2025 China (Western) International Semiconductor Industry Expo

2025 China (Western) International Semiconductor Industry Expo

Date: October 28-30, 2025

Location: Western International Expo City

Drive the future, move the world with chips, innovate technology, and lead the future with intelligence

Organizational unit: Beijing Mingman International Exhibition Co., Ltd

Organizer: Beijing Mingman International Exhibition Co., Ltd

Preface: As we enter 2025, "independent innovation" is once again on the rise, and the upward trend of the semiconductor industry is considered a more certain trend. Given the increasing demand for global artificial intelligence (AI) and high-performance computing (HPC) in 2025, from cloud data centers and terminal devices to specific industrial fields, major application markets are facing the trend of upgrading specifications. The semiconductor industry will once again usher in a new prosperous scene. Microelectronics, as an important component of electronic engineering technology, focuses on the design and manufacturing of semiconductor devices, integrated circuits, etc. This field is constantly expanding its application scope with technological progress and digital transformation, from consumer electronics to automotive electronics, from communication devices to medical devices, microelectronics technology is ubiquitous. The semiconductor exhibition has developed into one of the most influential professional exhibition platforms in the semiconductor industry. The Western International Semiconductor Industry Expo is expected to exhibit an area of 50000 square meters, join hands with more than 700 exhibitors, and launch exciting 50+themed activities. It is expected to attract over 80000 industry visitors. The 2025 (Western) International Semiconductor Industry Expo (referred to as the Western Semiconductor Exhibition) will be held from October 28th to 30th, 2025 at the Western International Expo City in Chengdu. This exhibition will focus on various sub sectors of the semiconductor industry, comprehensively showcasing new technologies, products, highlights, and trends in the semiconductor industry. It will gather more than 500 exhibitors, focusing on artificial intelligence, computing power storage, chip design, wafer manufacturing, advanced packaging, semiconductor specialized equipment and components, advanced materials and carbon materials, silicon carbide/gallium nitride and other third-generation semiconductors IGBT、 The Chengdu International Semiconductor Exhibition focuses on power devices, power electronics, and automotive semiconductors, showcasing the latest manufacturing and solutions for integrated circuits and semiconductors. From comprehensive promotion to meticulous on-site services, the exhibition is currently in full swing. We sincerely invite familiar 'old friends' and also welcome more' new faces' to continue joining us. We look forward to attending this influential and professional technology feast in the semiconductor industry with you.

Registration and Exhibition: October 26-27, 2025 Exhibition Opening: October 28, 2025 Exhibition Trading: October 28-30, 2025 Exhibition Cancellation: October 30, 2025 2:00 PM

Theme: "Drive the future, move the world with chips, innovate technology, and lead the future with intelligence"

Exhibition Contact: Beijing Mingman International Exhibition Co., Ltd. Address: No. 99 Shuixian West Road, Tongzhou District, Beijing Contact: Zhang Qin 18239215705 Phone: 010-86393617

Scope of Exhibition: Chip Design/Wafer Manufacturing Exhibition Area Integrated Circuit Design and Chip EDA、MCU、 Wafer manufacturing and equipment and components, etc; Chiplet and Advanced Packaging Exhibition Area: Chiplet, SiP packaging, wafer level packaging (WLP), 3D packaging, panel level packaging (PLP), TSV/TGV packaging, organic/silicon/glass substrates, packaging substrates, packaging carriers, IC carriers, semiconductor packaging materials and equipment, etc; Semiconductor specialized equipment/components exhibition area includes thinning machines, single crystal furnaces, grinding machines, heat treatment equipment, lithography machines, etching machines, ion implantation equipment, CVD/PVD equipment, cleaning equipment, cutting machines, mounting machines, bonding machines, testing machines, sorting machines, probe stations, and components; Advanced Materials/Carbon Materials/Diamond Semiconductor Exhibition Area: Silicon wafers and silicon-based materials, photomasks, electronic gases, photoresist and its supporting reagents, CMP polishing materials, target materials, packaging substrates, lead frames, bonding wires, ceramic substrates, chip bonding materials, carbon based materials, diamond semiconductors, graphite materials, superhard materials, etc; The third-generation semiconductor exhibition area includes nitride (GaN) and silicon carbide (SiC), zinc oxide (ZnO) diamond, wafers, substrates and epitaxy, power devices, IGBT packaging materials, RF devices and processing equipment, etc; Passive components, semiconductor discrete components/1GBT, 5G core components, special electronics, component power management, sensors, memory, connector relays, cables, plug-in devices, crystal oscillators, resistors, display devices, diodes, transistor filtering components, switches, and component materials and equipment in the component exhibition area; Power devices/power electronics/automotive semiconductor exhibition area includes automotive grade semiconductor control/computing chips, power semiconductors (IGBT and MOSFET), automotive grade SiC modules, power management chips, automotive electronic micro assembly and power devices, packaging and testing equipment, automation equipment, etc; Computing power, storage, artificial intelligence, CPO co packaging exhibition area for artificial intelligence chips, solutions, computing power chips and solutions, algorithm solutions, data storage, optoelectronic co packaging modules and technologies and equipment, etc; Semiconductor Display/Mini/Micro LED Exhibition Area: OLED, AMOLED, Mini/Micro LED Display, Flexible Display and Materials and Equipment, etc; International semiconductor material suppliers, well-known equipment suppliers, well-known packaging and testing, manufacturing, and contract manufacturers in the international brand area;

• Company:Beijing Mingman International Exhibition Co., Ltd
• Telephone:010-86393617
• Truename:Zhang Qin
• Mobile:18239215705
• Address:99 Shuixian West Road, Tongzhou District, Beijing

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