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2024 World Semiconductor Conference and Nanjing International Semiconductor Expo
Industry:

Communications / Electronics

Cycle:

Once a year

Time:

2024/06/05 - 06/07 (Wed To Fri Total 3 Days)    Error Correction

Address:

Jiangsu Province Nanjing International Expo Center ChinaJiangsu ProvinceNanjing CityJianye District 300 Jiangdong Middle Road, Jianye District, Nanjing City, Jiangsu Province

Sponsor:

Jiangsu Provincial Department of Industry and Information Technology Nanjing Jiangbei New Area Management Committee

Organizer:

Nanjing Runzhan International Exhibition Co., Ltd

Closed

INTRODUCTION

2024 World Semiconductor Conference and Nanjing International Semiconductor Expo - www.globalomp.com

2024 World Semiconductor Conference and Nanjing International Semiconductor Expo - www.globalomp.com

2024 World Semiconductor Conference and Nanjing International Semiconductor Expo

2024 World Semiconductor Congress and Nanjing International Semiconductor Expo

Time: June 5-7, 2024 Location: Halls 4 and 5 of Nanjing International Expo Center

sign upQian Cheng 18721020295

2024 World Semiconductor Conference and Nanjing International Semiconductor Expo - www.globalomp.com

Organizational structure

Organizer: Jiangsu Provincial Department of Industry and Information Technology

Nanjing Jiangbei New Area Management Committee

The People's Government of Pukou District, Nanjing City

Special support unit: China Institute of Electronic Information Industry Development

China Semiconductor Industry Association

Co organizer: National Integrated Circuit Packaging and Testing Industry Chain Technology Innovation Strategic Alliance Nanjing Integrated Circuit Industry Service Center

Shanghai Integrated Circuit Industry Association Zhejiang Semiconductor Industry Association Anhui Semiconductor Industry Association

Shaanxi Semiconductor Industry Association Third Generation Semiconductor Industry Technology Innovation Strategic Alliance National Integrated Circuit Innovation Center/China IC Unicorn Alliance Beijing Xinhehui Technology Co., Ltd

Undertaking unit: CCID Gujian Co., Ltd

Semiconductor Industry Association of Jiangsu Province

Economic Development Bureau of Nanjing Jiangbei New Area Management Committee

Nanjing Jiangbei New Area Industrial Technology Research and Innovation Park

Nanjing Pukou Economic and Technological Development Zone

Nanjing Runzhan International Exhibition Co., Ltd

Exhibition Introduction

Since the beginning of 2023, many regions across the country have released policies and key project plans to accelerate the development of the semiconductor industry chain, and a new round of industrial policy cycles is brewing; The restructuring of the Ministry of Science and Technology, reshaping China's scientific and technological innovation system, and accelerating the pace of technological self-reliance and breakthroughs in blockades; The second phase of the large fund has taken frequent actions, laying out key links such as domestic semiconductor manufacturing, equipment, materials, etc

Six years of deep cultivation, starting a new chapter

The World Semiconductor Conference and Nanjing International Semiconductor Expo is a highly influential and iconic industry leading exhibition in the semiconductor field of China, as well as an international brand exhibition certified by UFI. Since 2019, the exhibition area of the conference has increased by 67% in four years, with a surge in professional visitors at an average annual rate of 29%. The total number of participating companies has exceeded 1300, and the on-site audience has exceeded 60000, covering 34 provinces, cities, and regions across the country.

This year's conference will start with the UFI certification exhibition, adhering to the "2+N+1" hosting model (2 main forums+N parallel forums/special activities+1 professional exhibition), while starting a new journey in terms of specialization, internationalization level, scale and quality.

20+forum activities, over a hundred industry leaders leading the way

This year's conference will gather advantageous resources to focus on core technologies and future trends in the industry, and hold two main forums: a summit forum and an innovation summit. Focusing on the development trends of hot fields such as artificial intelligence, sensors, the Internet of Things, third-generation semiconductors, automotive semiconductors, and advanced packaging, N parallel forums were held, including the Artificial Intelligence Chip Innovation and Application Forum, the Yangtze River Delta Integrated Circuit Industry Innovation and Development Forum, and the EDA/IP Nuclear Industry Development Forum. More than 100 domestic and foreign experts, scholars, and industry elites were invited to attend together, Explore the development priorities and market opportunities of the global and Chinese semiconductor industry.

Theme Forum

Opening Ceremony/Summit Forum of the Conference

Innovation Summit

Parallel forums

Yangtze River Delta Integrated Circuit Industry Innovation and Development Forum

The 7th China IC Unicorn Forum

The 3rd Advanced Packaging Innovation Technology Forum

The 8th Integrated Circuit Talent Development Summit Forum

TSMC Customer Conference/Supplier Conference

EDA/IP Nuclear Industry Development Forum

Artificial Intelligence Chip Innovation Application Forum

IC Design Developer Conference

IC Future 2024 "Chip Power Product Launch Conference"

The 5th International Third Generation Semiconductor Industry Development Summit Forum

Semiconductors Gas Safety Seminar

Semiconductor Investment and Financing Forum

The 4th International Automotive Semiconductor Innovation Cooperation Forum

Closing ceremony

Special activities

IC experts check the pulse of the Jiangbei closed door meeting

Jiangbei Night Exchange Conference

Daily arrangements

Registration and exhibition setup: June 3-4, 2024 (09:00-17:00) Opening time: June 5, 2024 (09:00)

Exhibition time: June 5-7, 2024 (09:00-16:30) Closing time: June 7, 2024 (16:00)


Previous exhibitors (partial)

Semiconductor design enterprises

Beilian Guoxin, Changjing Technology, Xinshiyuan, Xinhuazhang, Binary Semiconductor, Creative Electronics, Xinxingji, Xingxin, Zhongkexin, Shenxin Technology, Software Valley Integrated Circuit Industry Alliance, EDA Innovation Center, Houmo Intelligent, Shenzhou Digital, Xindong Technology, Xingyao Semiconductor, Lingyange Chip Technology, Shunyuan Micro, Xinqiyuan, Dingjie Software, Tencent Cloud, etc;

Sealing and testing enterprises

Sunrise, Changdian Technology, Tongfu Microelectronics, Xinxiang Technology, Zibo Saibao, Shengxin Semiconductor, Xinde Technology, Chizhou Huayu, Shanghai Saimeite, Gaoxin Kegu, Haituo Instrument, Xifeng Optoelectronics, Hengsuo Huawei, Suzhou Shalikang, Nantong Meijing Micro, etc;

Manufacturing enterprises

TSMC, Huatian Technology, CCID, Yangjie Technology, Micro Nano, Sumida Electromechanical, Guoji Southern, Shoulei Laser, Shanghai Fance, etc;

Equipment and material enterprises

Xinhua Semiconductor, Luwen Instruments, Shengmei Shanghai, Xuzhou Bokang, Lianrui New Materials, China (Bengbu) Sensing Valley, Zhanghu Semiconductor, Changfei Fiber Optics, Philips, Jingrui, Dinglong Holdings, Zhongjuxin, Heyuan Special Gas, Hongxin Gas, Beixu Electronics, Danoer, New Silicon Technology, Meien Intelligence, Shanghai Langxi, etc;

Talent exhibition area enterprises

Cambrian, Longxin Zhongke, Aerospace Science and Engineering, Sandian Microelectronics, Eaton Xinchuang, Shusuan Technology, Yuanlei Nano, Chuhang Technology, Huachuang Microelectronics, Changfeng Aerospace, Xinjixun, Furui Microelectronics, Chuanzhi Yixin, Baijiayun, etc;

Contact Us |

If you want to book a booth and learn more information, please contact us through the following contact information:

Phone: 021-51096819

Fax: 021-51802029

Scope

Exhibition scope

1. IC Design Zone:

EDA, IP design, embedded software, digital circuit design, analog and mixed signal circuit design, integrated circuit layout design, etc.

2. Encapsulation testing zone:

Test probe table, testing machine, sorting machine, packaging equipment, packaging substrate, lead frame bonding wire, etc.

3. Semiconductor Materials Zone:

Silicon wafers and silicon-based materials, photomask templates, electronic gases, photoresists and their supporting reagents, CMP polishing materials, targets, packaging substrates, lead frames, bonding wires, packaging materials, ceramic substrates, chip bonding materials, etc.

4. Equipment Manufacturing Zone:

Thinner, single crystal furnace, grinder, heat treatment equipment, lithography machine, etching machine, ion implantation equipment, CVD/PVD equipment, cleaning equipment, cutting machine, loading machine, bonding machine, testing machine, sorting machine, probe table, etc.


Costs & Precautions

Please contact the exhibition organizer for implementation before participating in the exhibition.

2024 World Semiconductor Conference and Nanjing International Semiconductor Expo - www.globalomp.com


Contact

  • Truename:Qian Cheng
  • Mobile:18721020295
  • Address:300 Jiangdong Middle Road, Jianye District, Nanjing City, Jiangsu Province

Disclaimer

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870

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