The 15th Shanghai International Thermal Management Materials Technology Expo 2025

Simultaneously held: The 5th Shanghai International Data Center Liquid Cooling and Heat Dissipation Exhibition 2025

Date: December 17-19, 2025 Location: Shanghai New International Expo Center

Exhibition Information

The 15th Shanghai International Thermal Management Materials Technology Expo (CIME205) will be held from December 17-19 at the Shanghai New World Expo Center. It is the world's first exhibition in the thermal management industry and has been successfully held for 15 sessions since 2013. Since 2023, the exhibition has been held annually in Shenzhen in June and Shanghai in December. The exhibition is hosted by Bohan Exhibition and Liyue Exhibition, and co organized by Guangdong Adhesive Industry Association and Shenzhen Graphene Association. At the same time, it has received strong support from industry media chambers of commerce, associations, and other related industry institutions. The exhibition is positioned as "new materials, new opportunities, and new journeys", based in Shanghai, radiating nationwide and even global commerce, and helping enterprises open up the overall market. The exhibition gathers brand enterprises in various categories such as thermal conductive fillers, thermal interface materials, carbon materials, graphene, ceramic substrates, high-performance heat dissipation materials, liquid cooling heat dissipation technology, production and processing equipment, etc., providing a professional and efficient one-stop service platform for procurement selection and business exchange for professionals in the thermal control industry. At that time, we warmly welcome domestic and foreign thermal conductivity and heat dissipation material enterprises and related industry professionals to visit and exchange ideas!

Previous review: CIME 2024 Shanghai International Thermal and Heat Dissipation Materials Exhibition successfully concluded from December 18-20 at the Shanghai New International Expo Center. The exhibition area was 15000 square meters, with 306 exhibitors and a total of 18847 visitors over three days. Invitations to the exhibition include: Baitu Shares, Zexi New Materials, Yak Technology&Huafei Electronics, Yishitong, Jinge New Materials, Weishi New Materials, Xiayang New Materials, Yunhui Electronics, Yuzhou New Materials, Ningxia Shixing, Tao Feilun, Zhongci New Materials, Rou Carbon Electronics, Jin Haohui, Zhongke Flame Retardant, Haosen Mining, Military Porcelain Electronics, Jinchuan Group, Licheng New Materials, Nordste, Chaoweixin Materials, Juhetene Carbon, Unichemical, Jinghe Electronics, Taotao Electronics, Pinshuo Electronics, Chuyue Hot Transmission, Chengyinghua, Fanrui Yihui, Jinshan Electronics, Hande Electronics, Ningbo Jingdian, Jintao Shimo, North Huaxin Rubber, Indium Technology, Yizhao Electronics, Hongyi Thermal Management, Ruiquan Hardware, Zhenghe Aluminum Industry, Yihao Intelligence, Tongchuang Electronics, Deke Alloy, Beilifu, Hehe High tech, Entropy Flow Technology, Tianqian Technology, Space Liquid, Core Cooling Technology More than 300 outstanding exhibitors, including Lanyang Technology, Yuandi Technology, Da Tu Thermal Control, Yitian Electric, Aiteli, Hewu Precision, Liquid Cooling Technology, Xianhua Technology, Senjie CNC, Tuochuan Technology, Bobai Machinery, Dongjun Intelligence, Punos, Haoxi Technology, Kuite Electromechanical, Simada, Xili Grinding, Taiyi Shiye, etc., had on-site exchanges, with a complete range of exhibits covering thousands of new products in the entire thermal conductivity and heat dissipation industry chain, including thermal conductive fillers, thermal interface materials, thermal management and heat dissipation materials, various heat sinks and production equipment.

Target audience: We mainly invite executives from national, provincial, municipal, relevant research institutions, consumer electronics, power supply, automotive industry, electronics, household appliances, computers/computer components, displays, semiconductors, military supplies, optoelectronic/LED, frequency converters, mechanical industry, electronic equipment, electronic components, instruments and meters, communication/communication networks, medical instruments, wind power, solar energy, chassis/cabinets, chokes, integrated circuits, transistors, electrical appliances, transformers, welding equipment, power electronic devices and other enterprises to visit and negotiate.

Organizational Unit

Organizational structure: Bohan Exhibition (Shanghai) Co., Ltd

Shenzhen Liyue Exhibition Co., Ltd

Supporting unit: China Hot Design Network Beijing New Materials Technology Association

Top level event

◎ A professional, authoritative and international event - CIME 2025 will invite more than 400 well-known enterprises from more than 20 countries and regions, including South Korea, Britain, Belgium, France, Italy, Germany, the United States, Taiwan, China, China, etc., with an exhibition area of 20000 square meters.

Scope of exhibits:

Thermal conductive filler:

Inorganic Non Metals: Aluminum Oxide, Silicon Oxide, Zinc Oxide, Boron Nitride, Aluminum Nitride, Silicon Nitride, Silicon Carbide, Magnesium Oxide, Beryllium Oxide, Graphite, Carbon Black, etc; Metal powders: copper powder, silver powder, gold powder, nickel powder and aluminum powder, sodium potassium alloy, lead bismuth alloy, gallium indium alloy, liquid metal concentrate; Chemical raw materials: organic silicon, epoxy resin, polyurethane, acrylic resin, polyimide, phenolic resin, and chemical raw materials, etc

Electronic packaging materials: metal: aluminum, copper (beryllium copper), tungsten/copper, molybdenum/copper, silicon/aluminum, beryllium/aluminum, foam metal/porous metal, etc; Rubber; Ceramic materials: aluminum nitride, aluminum oxide, zirconium oxide, carbides, borides, nitrides, silicides; Glass, etc

Thermal conductivity and heat dissipation material:

Thermal interface materials: thermal conductive silicon tape, film/tape, thermal conductive silica gel, thermal conductive silicone grease, thermal conductive gel, thermal conductive potting adhesive, thermal conductive pad/carbon fiber thermal conductive pad, polymer based composite thermal conductive material, liquid metal, thermal conductive potting adhesive, etc

Ceramic substrates: alumina (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), beryllium oxide (BeO); Silicon carbide (SiC), boron nitride (BN), etc

Heat sink material: metal/alloy (semi-solid die-casting parts); Diamond/copper, diamond/aluminum and other composite materials, graphite/copper, graphite/aluminum and other composite materials, metal based composite materials

Thermal conductive polymers: Thermal conductive plastics (PPS, PA6/PA66, PC, PP, PPA, LDPE, PEEK), thermal conductive insulating plastics, thermal conductive rubber, etc

Carbon materials: graphite film (PI film), carbon nanotubes, carbon fiber short fibers, graphene thermal conductive film, diamond materials, etc

Phase change materials (thermal storage): paraffin, fatty alcohols, fatty acids, alkane based alloys; Molten salts, salt hydrates, eutectic mixtures, etc

Thermal insulation materials: aerogel materials (carbon base, silica, zirconia, alumina, etc.), carbon felt, composite silicate materials, etc

Thermal conduction and heat dissipation components:

Heat pipes/heat exchangers, copper-clad laminates, power devices (silicon carbide, gallium nitride, gallium oxide, MOSFETs, IGBTs) and modules, etc

Cooling fan accessories: copper, aluminum products, aluminum equipment, cooling profiles, iron cooling fins, sheet metal, metal stamping parts, chassis, cooling pads, finned tubes, heat pipes, heat plates, cooling modules, touchpad, fan grille, fan, motor, motor, fan automatic assembly machine, radiator welding, etc;

Heat dissipation equipment: liquid metal heat sink, profile heat sink, heat dissipation fan, heat dissipation module, heat pipe, plug-in heat sink, plug-in heat sink, chassis integrated heat sink, water-cooled heat sink, resistance heat sink, LED heat sink, CPU heat sink, IGBT heat sink, welding machine heat sink, rib heat sink, frequency conversion heat sink, heat pipe heat sink, forked heat sink, liquid cooling heat sink, combination heat sink, heat sink for solid-state relays, high-power transistor heat sink and related accessories, etc;

Exhibition area for liquid cooling and heat dissipation technology in data centers:

Raw materials: coolant, metal materials, etc. Liquid cooled plates: aluminum, copper, ammonia testing, brazing, insulation plastic, processing equipment, etc. Components: quick connectors, liquid cooled pipelines, water separators, expansion valves, throttle valves, solenoid valves, pumps, compressors, evaporators, heat exchangers, chassis, cooling distribution units, uninterruptible power supplies, filtration and purification devices, etc

Temperature control equipment: air conditioning, cold source equipment, fresh air systems, etc. Liquid cooling technology: cold plate liquid cooling, immersion liquid cooling, spray liquid cooling, intelligent temperature control technology, etc. Solutions: servers, data centers, energy storage, electric vehicles, etc. Innovative achievements: laboratory application research results, proprietary technologies, etc

Energy Storage and Thermal Management Exhibition Area

Temperature control system: environmentally friendly refrigerants, liquid cooling solutions, air cooling solutions, temperature control technology and equipment, energy storage battery thermal management solutions, fire and safety PCS thermal management liquid cooling solutions, etc. Thermal runaway monitoring and warning: temperature sensors, gas sensors (H2, VOC), battery management systems, etc. Thermal storage and management: phase change materials, thermal storage and exchange devices (packed bed, tube shell, and plate), device design,

Analysis and Testing:

Analytical instruments, laser thermal conductivity meter, thermal conductivity analyzer, thermal conductivity meter, thermal expansion meter, electronic thermal tester, air volume and pressure tester, laser thermal conductivity measurement instrument, material strength testing machine, thermal property measurement equipment, etc;

Processing equipment

Rolling machine, coating machine, slitting machine, die-cutting machine, rewinding machine, slicing machine; Roll cutting machine; Cutting machines, precision cutting machines, automated slitting machines, thermal conductive material production equipment, CNC coil cutting equipment, CNC machine tools, automated production lines and thermal transfer laboratories, complete process and customized equipment, etc; etc.

Thermal Design: Thermal Simulation/Thermal Design Software

• Telephone:189-3049-1940
• Truename:Zhang Desong
• Mobile:189-3049-1940
• Address:No. 2345 Longyang Road, Pudong New Area, Shanghai

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