In order to promote the leapfrog development of the electronic information industry in South China and promote the innovative application of advanced technologies in the region, the 105th Shenzhen International Electronics Exhibition and Precision Electronic Ceramics and Power Semiconductor Industry Exhibition, created by China Electronics Equipment Corporation, will be held at the Shenzhen Convention and Exhibition Center from April 9-11, 2025. It will showcase electronic ceramics, integrated circuits, electronic components, semiconductors/chips, display technology, Internet of Things technology, sensors, connectors, wireless, power supply, testing technology, electronic materials, SMT surface mount, intelligent hardware, production equipment and industry solutions. At that time, the organizing committee will invite tens of thousands of professional engineers from domestic and foreign industries such as industrial electronics, automotive electronics, medical electronics, Internet of Things, consumer electronics, and communication to purchase and visit. In 2025, we look forward to meeting you in Shenzhen and working together to explore new opportunities in the electronics industry! There will be multiple technical forums and exchange meetings during the implementation period. At that time, we sincerely invite domestic and foreign application field enterprises, research institutions, and associations/societies to visit, exchange, negotiate, and purchase at the exhibition site.

Precision Ceramic Industry Chain: 1. Ceramic Devices and Materials: MLCC、LTCC、HTCC、 Microwave dielectric ceramics, piezoelectric ceramics, barium titanate, barium carbonate, titanium oxide, aluminum oxide, zirconium oxide, glass powder, aluminum nitride, LTCC dielectric ceramic powder, rare earth oxides, ceramic strips, etc;

2. Precision ceramics: zirconia, alumina, aluminum nitride, silicon nitride, silicon carbide, yttrium oxide, structural ceramics, high-temperature ceramics, transparent ceramics, ceramic microbeads, new energy ceramics, ceramic bearings, ceramic balls, semiconductor ceramics (handling arms, ceramic cleavers, electrostatic chucks, etching rings...), 3D printed ceramics, fuel cell (SOFC) separators, wearable ceramics, fiber optic ceramic inserts, ceramic sleeves CIM、 Bioceramics, etc.

3. Ceramic substrate and packaging shell: ceramic packaging shell, DPC, DBC, AMB, HTCC substrate, LTCC substrate, thin film circuit board, thick film circuit board, ceramic packaging base, heat sink, aluminum oxide, aluminum nitride, silicon nitride, beryllium oxide, mullite powder and substrate, etc;

4. Metal materials: silver powder, gold powder, copper powder, nickel powder, solder (solder pads, solder paste), MLCC internal/external electrode paste, LTCC silver paste, gold paste, tungsten molybdenum paste, copper paste, target material, oxygen free copper strip, Kovar alloy, metal stamping parts, etc;

5. Additives: dispersants, adhesives, plasticizers, coagulants, mineralizers, defoamers, lubricants, sintering aids, etc. for ceramics and conductive slurries;

6. Equipment: ceramic processing equipment: sand mill, ball mill, vacuum defoaming machine, three roll machine, spray granulator, dry press, tape casting machine, injection molding machine, 3D printer, mold, drying equipment, grinder, precision engraving machine, cutting machine, laser equipment, punching machine, hole filler, screen printing machine, laminating machine, laminating machine, isostatic press, hot cutting machine, leveling machine, glue discharge furnace, sintering furnace, brazing equipment, electroplating equipment, chemical plating, silver spraying machine, silver dipping machine, silver terminal machine, vacuum coating equipment, developing equipment, film removal equipment, etching machine, wet process equipment, plasma cleaning, ultrasonic cleaning, Automation equipment, peel strength tester, AOI detection equipment, marking machine; Packaging testing equipment: SMT machine, wire bonding machine, capping machine, parallel seam welding sealing cap, rib cutting machine, brazing equipment, laser resistance adjustment machine, network analyzer, thermal cycling testing equipment, thickness gauge, helium leak detector, aging equipment, appearance inspection, ultrasonic scanning microscope, X-ray detection, laser marking, sorting equipment, packaging tape machine, etc;

7. Consumables: release film, carrier tape (plastic and paper), refractory materials, firing plate/box bowl (alumina, corundum mullite, boron nitride, etc.), firing mesh, foam adhesive, grinding consumables (diamond powder, grinding solution), precision screen, cleaning agent, electroplating solution, etc.

2、 Thermal management industry chain:

1. Thermal management materials: aluminum oxide, aluminum nitride, boron nitride, graphene, graphite, carbon nanotubes, hollow glass beads, thermal conductive powder, heat dissipation substrate, heat sink (tungsten copper, molybdenum copper, aluminum nitride, diamond, etc.), aluminum silicon carbide AlSiC, phase change materials, thermal conductive gel, thermal conductive interface materials, thermal conductive gaskets, thermal conductive tape, potting compound, heat pipe/soaking plate;

2. Heat dissipation devices: semiconductor cooling element (TEC), IGBT heat sink (copper, aluminum), high-power transistor heat sink, communication base station heat dissipation shell, liquid metal heat sink, pin type heat sink, etc;

3. Equipment: calendering machine, coating machine, slitting machine, die-cutting machine, rewinding machine, slicing machine, CNC equipment, die-casting/stamping equipment, thermal analysis instrument, laser thermal conductivity meter, thermal conductivity meter, strength testing machine, testing equipment, automation, etc.

3、 Power semiconductor device packaging industry chain:

1. Materials: silicon carbide, ceramic lining plate (DBC, AMB), sealed pipe shell, bonding wire, heat dissipation base plate (copper, aluminum silicon carbide AlSiC), heat conductive silicon gel, epoxy potting adhesive, solder (prefabricated solder), silver film/silver paste, radiator (copper, aluminum), power outlet terminal (copper terminal), shell (engineering plastic PPS, PBT, high temperature nylon), cleaning agent, etc;

2. Equipment and accessories: vacuum welding furnace, surface mount machine, solidification machine, wire bonding machine X-ray、 Push pull testing machine, plasma cleaning equipment, dispensing machine, screen printing machine, ultrasonic scanning equipment, dynamic and static testing machine, point/glue filling machine, silver sintering equipment, vertical curing furnace, formic acid vacuum eutectic furnace, automatic sealing equipment, high-speed pin insertion machine, bending equipment, ultrasonic welding machine, visual inspection equipment, push pull testing machine, high and low temperature impact equipment, power cycle testing equipment, marking machine, inspection platform, fixture, etc;

• Company:Qiyao Exhibition (Shanghai) Co., Ltd
• Telephone:021-68788226
• Truename:Xu Jian
• Mobile:15821681410
• Address:No. 559 Fengjin Road, Fengxian District, Shanghai

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870