Focusing on cutting-edge technological breakthroughs, empowering industrial innovation and integration

Create an innovative display, one-stop procurement, and technology exchange exhibition platform for the entire power semiconductor industry chain!

The 2025 Asia International Power Semiconductor, Materials and Equipment Technology Exhibition, jointly organized by APSME organizers Shenzhen Xinxinneng Exhibition Co., Ltd. and Guangzhou Jiashi Watson Exhibition Co., Ltd. and semiconductor industry organizations, will be held from November 20-22, 2025 at the Poly World Trade Center Expo in Guangzhou; The exhibition brings together high-quality brand manufacturers from around the world to create an innovative display, one-stop procurement, and technical exchange platform for the entire power semiconductor industry chain. It focuses on showcasing hot door products such as semiconductor devices, power modules, materials, packaging technology, testing technology, production equipment, and heat dissipation management. It is committed to advanced semiconductor devices, packaging testing, process flow, innovative applications, and cooperation between industry chains, building a bridge for communication and cooperation between upstream and material equipment. During the exhibition, a series of technical forums will also be held to showcase global industry trends and future technological trends.

The exhibition plans to have an exhibition area of 20000 square meters and will attract 300 exhibitors from around the world. At the same time, the organizing committee will invite over 10000 professional visitors to gather and participate in the exhibition; These professional audiences come from world-renowned power semiconductor manufacturers and industry users such as Huawei Technologies, BYD Semiconductors, ROHM Semiconductors, Hewang Electric, STMicroelectronics, Infineon, Xiaopeng Motors, FAW Hongqi, Xinju Energy Semiconductor, Painjie Semiconductors, CRRC Times Semiconductors, Fengpeng Electronics, Longteng Semiconductors, Yangjie Electronics, TBEA, Sunac, Jinzhan Semiconductors, China Resources Microelectronics, NXP, Ruineng Semiconductors, Dongwei Semiconductors, Open Source Digital Creation Electronics, Fuji Electric, Basic Semiconductors, LONGi Green Energy, Gongcheng Semiconductors, Pingchuang Semiconductor Research Institute, Jufeng Semiconductors, Tongwei Solar, Freddie Power, Semicon Danfoss, GAC Group, Intel, Silanwei, Riich Moonlight, Flat Head Brother, GAC Aion New Energy, Xinke Integrated Circuit Hongwei Technology, United Electronics, Cuizhan Microelectronics, Lipsi Semiconductor, Ansenmei, Anshi Semiconductor, Bosch Semiconductor, Xianzhike Semiconductor, Senguoke, Fulehua Semiconductor, Qingchun Semiconductor, Huahong, Shengbangwei, Xinjieneng, Huada Semiconductor, Shenzhen Aisite EPC's GaN Power IC、 Delta Electronics, New Clean Energy, Leshan Hill Electronics, VIA Semiconductors Power Integrations、 Representatives from buyers such as Guoxing Optoelectronics, Huayi Microelectronics, Renesas Electronics, Samsung Electronics, Weishi Semiconductor, Huichuan Technology, Ningde Times, Yingbo Electric, Xinen Integrated Circuit, Midea, etc. visited this exhibition to explore the charm of technology up close and contribute to the innovative development of the power semiconductor industry.

The organizer will hold a variety of concurrent forum activities

Various themed technical forums will be held concurrently with the exhibition to showcase products in various exhibition areas. The organizing committee will strictly screen the guest speakers and speech topics, with a focus on technology and appropriate brand promotion to ensure that the technology forum introduces advanced and cutting-edge power semiconductor technologies from around the world, and presents a "delicious dish" to the semiconductor industry professionals.

▶ Automotive Grade Power Semiconductor Forum

▶ Power Semiconductor IGBT/SiC Industry Forum

▶ Forum on the Development of Compound Semiconductor Technology and Applications

▶ GaN Gallium Nitride | Semiconductor Power Device Technology Forum

▶ Power MOSFET Si/SiC Silicon Carbide | Semiconductor Power Device Technology Forum

▶ Forum on Innovative Development of Silicon Carbide Substrate Material Growth and Processing Technology

▶ Third Generation Semiconductor Material Manufacturing and Equipment Technology Summit Forum

▶ Forum on Performance Development and Testing Technology of Power Semiconductor Devices

Welcome to inquire with the APSME 2025 Conference Organizing Committee:

Exhibition contact person: Manager Li 132 6539 6437 (same as WeChat)

Visit or group visit contact person: Ms. Yang 131 7886 7606 (same as WeChat)

Advertising seats and booths have been fully launched, please book as soon as possible. You can contact the organizing committee to request the exhibition contract and booth floor plan! From now on, visitors can make an appointment to register for free visit through the official account and telephone channels. More exciting things waiting for you to unlock on site!

Committed to the cooperation of advanced power semiconductor devices, packaging testing, process flow, innovative applications, and industrial chains, building a bridge for communication and collaboration between upstream and material equipment.

▶ IGBT/MOSFET power devices: power devices and power ICs, which in turn include diodes, transistors, and thyristors;

▶ Third generation semiconductor materials: wide bandgap semiconductor materials represented by silicon carbide (SiC), gallium nitride (GaN), zinc oxide (ZnO), diamond, gallium arsenide, and aluminum nitride (AIN);

▶ Power semiconductor equipment and components: thinning machine, single crystal furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, ion implantation equipment, CVD/PVD equipment, solidification machine, plasma cleaning equipment, cutting machine, mounting machine, bonding machine, wire bonding machine, reflow soldering, wave soldering, testing machine, sorting machine, coupling machine, carrier forming machine, detection equipment, constant temperature and humidity test box, sensor, packaging mold, testing fixture, precision slide table, stepper motor, valve, probe station, clean room equipment, water treatment and power semiconductor equipment components, etc;

▶ Power semiconductor testing/inspection equipment: dynamic parameter testing equipment, static parameter testing equipment, power cycle testing equipment, reliability testing of power semiconductor devices, constant temperature and humidity test chamber, X-ray 3D inspection equipment, etc;

▶ Design and development: EDA, IP design, embedded software, digital circuit design, analog and mixed signal circuit design, integrated circuit layout design, IDM, Fabless factory, etc;

▶ Packaging testing: screen printing, automatic SMT, vacuum reflow soldering, ultrasonic cleaning, X-RAY defect detection, automatic bonding, laser marking, shell plastic sealing, power terminal bonding, shell gluing and curing, packaging, terminal forming, functional testing;

▶ Thermal management: The thermal management material industry chain includes thermal interface materials, carbon nanomaterials such as graphene, and carbon nanotubes; High thermal conductivity packaging materials (beryllium oxide, aluminum oxide, aluminum nitride, silicon nitride, silicon carbide), as well as aluminum Al, copper Cu, molybdenum Mo, Kovar alloy/Silvar alloy, Cu-W, Cu Mo, Cu/Invar/Cu, Cu/Mo/Cu, etc., thermal storage materials (phase change materials), thermoelectric cooling devices (TEC), adhesives, and their processing and testing equipment, consumables, etc.

• Company:Shenzhen Xinxinneng Exhibition Co., Ltd
• Telephone:131 7886 7606
• Truename:Mr. li
• Mobile:132 6539 6437
• E-mail:lilin@jswatsonexpo.com
• Address:1000 Xingang East Road, Haizhu District, Guangzhou City

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870