Exhibition Introduction:

Semiconductor equipment is the cornerstone that supports the development of the electronics industry. In recent years, many domestic semiconductor equipment companies have made progress in key areas, and leading enterprises in material components have also shown a rapid growth trend. The structure of China's semiconductor industry is gradually optimizing, and the industrial chain is gradually improving, forming a situation of mutual promotion and common development. Aiming for the future, it is necessary to further strengthen the supporting capabilities of the industrial chain and formulate scientific and reasonable development strategies.

China holds an important position in the global semiconductor market and is also the largest equipment market in the world. In the entire semiconductor equipment industry chain, Chinese manufacturers are beginning to emerge and have a good development momentum, with the market size increasing year by year In order to ensure the smooth and stable development of the semiconductor industry supply chain, the "2025 Shenzhen International Semiconductor Manufacturing Equipment Materials and Core Components Exhibition" organized by China Electronics Equipment Co., Ltd. and Shenzhen Flat Panel Display Industry Association is scheduled to be held at the Shenzhen Convention and Exhibition Center (Futian) from April 9-11, 2025, in conjunction with the "2025 13th China Electronic Information Expo". The exhibition, with the theme of "Creating" Chips "Leading the Way, Intelligent Manufacturing the Future", has attracted many well-known semiconductor and core component manufacturers, experts and scholars, and industry elites from home and abroad to discuss the development trends and future prospects of the semiconductor industry together. In addition to equipment display, this exhibition also set up multiple forums and seminars, inviting numerous industry experts and scholars to conduct in-depth discussions on the development trends, technological innovation, market applications, and other aspects of the semiconductor industry. Participants expressed that with the rapid development of technologies such as 5G, IoT, and artificial intelligence, the semiconductor industry is facing unprecedented opportunities for growth, but also numerous challenges and difficulties. Therefore, strengthening technological innovation and talent cultivation, promoting industrial transformation and upgrading, has become an important direction for the development of the semiconductor industry.

Scope of exhibits:

Semiconductor specialized equipment&components exhibition area: thinning machine, single product furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, ion implantation equipment, CVD/PVD equipment, cleaning equipment, cutting machine, mounting machine, bonding machine, testing machine, sorting machine, probe station and components, etc.

Design, Chip, Wafer Manufacturing and Packaging Exhibition Area: Integrated Circuit Design, Wafer Manufacturing, SiP Advanced Packaging Technology Power device packaging and testing, MEMS packaging technology Silicon wafers and IC packaging carriers, packaging substrates and application manufacturing and packaging testing, EDA software, MCU microcontrollers, packaging substrate semiconductor materials and equipment, and components.

New Display Exhibition Area: OLED、AMOL .ED、Mini/Micro LED、 Silicon based display, flexible display technology, etc.

Compound Semiconductor Exhibition Area: Gallium Nitride (GaN) and Silicon Carbide (SiC), Zinc Oxide (ZnO) Diamond, Wafer, Substrate and Epitaxy, Power Devices, IGBT Packaging Materials, RF Devices and Processing Equipment, etc.

Advanced Packaging Technology Exhibition Area: Semiconductor Control and Computing Chips, Power Semiconductor IGBT and MOSFET Vehicle grade SiC modules, energy storage power supplies and sensors, automotive electronic micro assembly and power devices, packaging testing equipment, automation equipment, instruments and components.

Advanced Materials Exhibition Area: Silicon wafers and silicon-based materials, photomask templates, electronic gases, photoresist and its supporting reagents, CMP polishing materials, target materials, packaging substrates, lead frames, bonding wires, ceramic substrates, chip bonding materials, etc.

• Company:Lijia Exhibition (Shanghai) Co., Ltd
• Truename:Mr. Lu
• Mobile:13818219172
• E-mail:3087083730@qq.com
• Address:Shanghai

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