The 7th Shenzhen International Semiconductor Exhibition (SEMI-e) will be held from June 25-27, 2025 at Hall 4/6/8 of the Shenzhen International Convention and Exhibition Center (Bao'an New Hall)! This exhibition will focus on various sub sectors of the semiconductor industry, comprehensively showcasing new technologies, products, highlights, and trends in the semiconductor industry. It will gather over 900 exhibitors to showcase third-generation semiconductors such as artificial intelligence, computing power storage, chip design, wafer manufacturing, advanced packaging, semiconductor specialized equipment and components, advanced materials and carbon materials, and silicon carbide/gallium nitride IGBT、 Focusing on power devices, power electronics and automotive semiconductors, photovoltaic semiconductors, display semiconductors, etc., we comprehensively showcase the latest manufacturing and solutions for integrated circuits and semiconductors.

SEMI-e has been deeply involved in the field of semiconductor exhibitions for many years and has developed into one of the most influential professional exhibition platforms in the semiconductor industry. The 7th SEMI-e 2025 Shenzhen International Semiconductor Exhibition is jointly organized by multiple industry associations and will continue to cover an exhibition area of 60000m ². With over 900 exhibitors, it will open up exciting 50+themed activities and is expected to attract more than 70000 industry visitors.

Looking back at the previous SEMI-e 2024, the exhibition area was nearly 60000 square meters, gathering 815 exhibitors. The exhibits covered semiconductor equipment, chip design/wafer manufacturing/advanced packaging, third-generation semiconductors, semiconductor components, advanced materials, automotive semiconductors, and other fields, covering the entire semiconductor industry chain. At the same time, the "6th Shenzhen Semiconductor Industry Technology Summit", "5th Third Generation Semiconductor Industry Development Summit Technology Forum", "2024 China Automotive Semiconductor Conference", "2024 Today's Semiconductor Localization Trend Summit" and "Bao'an Business Environment Promotion and Semiconductor Enterprise Supply and Demand Matchmaking Conference" were held. The conferences focused on hot topics such as automotive chips, autonomous driving technology, automotive power devices, advanced packaging and testing technology, and new semiconductor (GaN/SiC) material preparation, attracting experts and experts from multiple fields such as the semiconductor industry, automotive new energy, and consumer electronics to visit and exchange ideas, promoting capacity expansion, and helping to deeply connect high-quality resources. SEMI-e Joining hands with Shanghai Huali, Huatian Technology, Tongfu Microelectronics, Shengmei Semiconductor, Tianke Heda, China Electronics Technology 45th Research Institute, Zhonghuan Leading, BYD Semiconductor, Huajin Semiconductor, Nansha Wafer, Northern Huachuang, Shanghai Microelectronics Equipment, Changchuan Technology, Pioneer, Genesis, Saimete, Fangzheng Micro, Taike Tianrun, Beiling Co., Ltd., Shichuang, Aisite, Rilian Technology, Xinqi Microelectronics, Hualin Jiaye, Shunluo Electronics, Zhongke Saifei, Zhicheng Semiconductor, Suzhou Qiqi, Maiwei Technology, Tongguang Co., Ltd., Tianyu, Liande Semiconductor, Yujing Machinery, Xichan Microchip, Xinxiang, Zhiying Intelligent, Medview, Global, Youjie, Kaidi Microelectronics, Xinpu, Leiming, Kawasaki Robotics, Neway Applied Materials, Microelectronics, Yujing Technology, Enton Semiconductor, Leibo Microelectronics, Shuocheng Group, Leica Companies such as DeKangweier, Yuhuan, Shenwu, Otwei, and Boranrun are working together to create a high-quality industry event and strive for development. SEMI-e is committed to providing exhibitors with a high-level, high-end, and high-quality platform for exhibition and communication!

In addition, from the perspective of the entire industry chain, Shenzhen is undoubtedly one of the best markets for innovation and application in the semiconductor industry in Asia, attracting the attention of many well-known enterprises and investors. SEMI-e relies on the solid foundation laid in the early stage to provide precise market docking services for participating enterprises. Representatives from over a thousand leading companies, including Huawei, Yuexin, Sunac Power, Changjiang Storage, SMIC, Huahong, Zengxin, Intel, CR Micro, Sanan, Yuexin, Fangzheng Micro, Huatian, Pengxinxu, Changdian Technology, Tongfu Microelectronics, Pengxin Micro, Hailis, Tianke Heda, Beifang Huachuang, Shengmei Semiconductor, ROHM, Infineon, BYD, NIO, FAW, Xiaopeng, gathered together, covering more than 50 industry leaders such as wafer fabs, packaging and testing plants, equipment manufacturers, silicon carbide, automotive manufacturers, inverter factories, consumer electronics, and power electronics. In addition, 352 institutions including Bao'an District Commerce Bureau, Bao'an District Enterprise Service Center, Guangzhou Academy of Sciences Semiconductor Research Institute, Shenzhen Semiconductor Industry Association, Semiconductor Display Association, etc. visited the Guangdong Integrated Circuit Park in groups. SEMI-e is not only a showcase for technology, but also an important platform for industry exchange, cooperation, and innovation. Through effective market exposure, precise business matching can be achieved!

From comprehensive promotion and advertising to meticulous on-site service, the 7th Shenzhen International Semiconductor Exhibition (SEMI-e 2025) is currently in full swing. We cordially invite familiar 'old friends' to make a comeback, and also welcome more' new faces' to continue joining us. We look forward to attending this influential and professional technology feast in the semiconductor industry with you!

Chip Design, Wafer Manufacturing, and Packaging Exhibition Area
Integrated circuit design and chip, wafer manufacturing, SiP advanced packaging, power device packaging and testing MEMS packaging and testing, silicon wafer and IC loading board, packaging substrate and application manufacturing and packaging testing EDA、MCU、 Semiconductor materials, equipment, and components for packaging and testing substrates

Exhibition Area for Semiconductor Specialized Equipment/Components
Thinning machine, single crystal furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, ion implantation equipment, CVD/PVD equipment, cleaning equipment, cutting machine, mounting machine, bonding machine, testing machine, sorting machine, probe station and components, etc

Advanced Materials/Carbon Materials/Diamond Semiconductor Exhibition Area
Silicon wafers and silicon-based materials, photomasks, electronic gases, photoresist and its supporting reagents, CMP polishing materials, target materials, packaging substrates, lead frames, bonding wires, ceramic substrates, chip bonding materials, carbon based materials, diamond semiconductors, graphite materials, superhard materials, etc

Third Generation Semiconductor Exhibition Area
Nitriding (GaN) and silicon carbide (SiC), zinc oxide (ZnO) diamond, wafers, substrates and epitaxy, power devices, IGBT packaging materials, RF devices and processing equipment, etc

IC Carrier/Ceramic Substrate Exhibition Area
IC carrier board and packaging process (substrate, copper and other structural materials, dry film, gold salt and other chemicals/consumables) Chiplet packaging technology, storage, MEMS and chip applications and materials, equipment, ceramic substrate and packaging materials and equipment, etc

Component Exhibition Area
Passive components, semiconductor discrete devices/1GBT, 5G core components, special electronics, component power management, sensors, memory, connector relays, cables, plug-in devices, crystal oscillators, resistors, display devices, diodes, transistor filtering components, switches and component materials and equipment

Power Devices/Power Electronics/Automotive Semiconductors Exhibition Area
Automotive grade semiconductor control/computing chips, power semiconductors (IGBT and MOSFET), automotive grade SiC modules, power management chips, automotive electronic micro assembly and power devices, packaging and testing equipment, automation equipment, etc

Computing power, storage, artificial intelligence, CPO packaging area
Artificial intelligence chips, solutions, computing power chips and solutions, algorithm solutions, data storage, optoelectronic co packaging modules and technologies and equipment, etc

Semiconductor Display/Mini/Micro LED Exhibition Area
OLED, AMOLED, Mini/Micro LED displays, flexible displays, materials and equipment, etc

International Brand Zone
International semiconductor material suppliers, well-known equipment suppliers, well-known packaging and testing, manufacturing, contract manufacturers, etc

Please contact the exhibition organizer before participating in the exhibition to confirm.

• Telephone:400-902-992
• Truename:Manager Feng
• E-mail:523138820@qq.com
• QQ:363064371
• Address:8th Floor, No. 23, Lane 733, Hengfei Road, Shanghai

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