The 12th Shenzhen International Exhibition of Thermal and Cooling Materials and Equipment in June 2024

Time: June 28-30, 2024

Location: Shenzhen New International Expo Center

Organizers: Bohan Exhibition (Shanghai) Co., Ltd. and Shanghai Liyue Exhibition Service Center

Co organizers: Beijing New Materials Technology Association, China Thermal Design Network

Sponsors: Tianjin Zexi New Materials Co., Ltd., Shanghai Baitu New Materials Technology Co., Ltd., Zhejiang Daoming Superconducting Technology Co., Ltd

Perfectly presenting the entire industry chain of thermal and heat dissipation materials and new materials

With the requirement of 5G technology for big data and high-performance computing, high power consumption and high heat flux density pose challenges to the thermal management of electronic devices, and promote the market demand for thermal conductive and heat dissipation materials. Traditional heat dissipation materials such as graphite sheets, thermal paste, and copper foil have seen a significant increase in both quantity and price in the 5G era, and the requirements for thermal conductivity have also sharply increased. New thermal conductivity and heat dissipation materials such as ultra-thin heat pipes, VC soaking plates, phase change materials, and carbon fiber thermal conductive sheets have also been widely used. Thermal management products and solutions are entering a period of vigorous development.

The heat dissipation solutions in high-power equipment fields such as 5G base stations and data centers are accelerating the transition from heat pipe heat sinks to high heat flux heat dissipation solutions such as new expansion plates, VC heat sinks, and internal circulation liquid cooling. Thermal conduction heat dissipation brings new industrial opportunities.

In order to further promote communication and interaction in the thermal and cooling industry, strengthen the awareness of communication and cooperation in China's thermal and cooling industry, and achieve mutual promotion and common development, the 11th Shanghai International Thermal and Cooling Materials and Equipment Exhibition 2023, hosted by Bohan Exhibition (Shanghai) Co., Ltd. and Shenzhen Liyue Exhibition Co., Ltd., will be held at the Shanghai New International Expo Center from December 13th to 15th, 2023. At that time, we warmly welcome domestic and foreign thermal conductivity and heat dissipation material enterprises and related industry professionals to visit and exchange ideas!

As a globally renowned professional exhibition in the thermal management industry, the CIME exhibition will delve into user industry fields such as electronics and power, semiconductors, communications, consumer electronics, new energy vehicles, power batteries, AR/VR, big data/cloud computing, artificial intelligence, etc. In addition to fully showcasing high-end thermal and cooling materials, the exhibition also includes thermal and cooling raw materials, thermal interface materials, cooling components, and related processing and production equipment. The Shanghai exhibition will establish a new data center liquid cooling technology exhibition area and a new energy vehicle battery module and PACK material exhibition area, creating an efficient thermal management trade platform while also meeting the needs of enterprises to explore the market and integrate development.

Exhibition scope

Thermal conductive filler

Inorganic non-metals: aluminum oxide, silicon oxide, zinc oxide, boron nitride, aluminum nitride, silicon nitride, silicon carbide, magnesium oxide, beryllium oxide, graphite, carbon black, etc;

Metal powders: copper powder, silver powder, gold powder, nickel powder and aluminum powder, sodium potassium alloy, lead bismuth alloy, gallium indium alloy, liquid metal solution;

Chemical raw materials: organosilicon, epoxy resin, polyurethane, acrylic resin, polyimide, phenolic resin, and chemical raw materials, etc

Electronic packaging materials

Metal: aluminum, copper (beryllium copper), tungsten/copper, molybdenum/copper, silicon/aluminum, beryllium/aluminum, foam metal/porous metal, etc; Rubber;

Ceramic materials: aluminum nitride, aluminum oxide, zirconia, carbides, borides, nitrides, silicides; Glass, etc

Thermal conductive and heat dissipation materials

Thermal interface materials: thermal conductive silicon tape, film/tape, thermal conductive silica gel, thermal conductive silicone grease, thermal conductive gel, thermal conductive potting adhesive, thermal conductive pad/carbon fiber thermal conductive pad, polymer based composite thermal conductive material, liquid metal, thermal conductive potting adhesive, etc

Ceramic substrates: alumina (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), beryllium oxide (BeO); Silicon carbide (SiC), boron nitride (BN), etc

Heat sink material: metal/alloy (semi-solid die-casting parts); Diamond/copper, diamond/aluminum and other composite materials, graphite/copper, graphite/aluminum and other composite materials,

Metal based composite materials

Thermal conductive polymers: thermal conductive plastics (PPS, PA6/PA66, PC, PP, PPA, LDPE, PEEK), thermal insulation plastics, thermal rubber, etc

Carbon materials: graphene, graphite film (PI film), carbon nanotubes, carbon fiber short fibers, graphene thermal conductivity film, diamond materials and other phase change materials (heat storage): paraffin, fatty alcohols, fatty acids, alkane based alloys; Molten salts, salt water complexes, eutectic mixtures, etc

Thermal insulation materials: aerogel materials (carbon base, silica, zirconia, alumina, etc.), carbon felt, composite silicate materials, etc

Thermal conductivity and heat dissipation components

Heat pipes/soaking plates, copper clad plates, power devices (silicon carbide, gallium nitride, gallium oxide, MOSFET, IGBT) and modules, etc

Cooling fan accessories: copper, aluminum products, aluminum equipment, cooling profiles, iron cooling fins, sheet metal, hardware stamping parts, chassis, cooling pads, fin tubes, heat transfer tubes, heat transfer plates, cooling modules, touch panels, fan mesh covers, fans, motors, fan automatic assembly machines, radiator welding, etc; Heat dissipation equipment: liquid metal heat sink, profile heat sink, heat dissipation fan, heat dissipation module, thermal conduit, plug-in heat sink, plug-in heat sink, integrated heat sink for chassis, water-cooled heat sink, resistance heat sink, LED heat sink, CPU heat sink, IGBT heat sink, welding machine heat sink, ribbed heat sink, variable frequency heat sink, heat pipe heat sink, cross finger heat sink, liquid cooling heat sink, combination heat sink Solid state relay heat sink, high-power transistor heat sink and related accessories, etc;

Analysis and Testing

Analytical instruments, laser thermal conductivity meters, thermal conductivity analyzers, thermal conductivity meters, thermal expansion meters, electronic thermal testers, air flow and pressure testers, laser thermal conductivity meters, material strength testing machines, thermal property measurement equipment, etc;

Processing equipment

Rolling machine, coating machine, slitting machine, die-cutting machine, rewinding machine, slicing machine; Cutting and rolling machine; Slitting machines, precision cutting machines, automated slitting machines, thermal conductive material production equipment, CNC coil cutting equipment, CNC machine tools, automated production lines and heat transfer laboratories, complete sets of processes and customized equipment, etc;

Thermal design

Thermal simulation/thermal design software

Data Center Liquid Cooling and Cooling Technology Exhibition Area

Exhibition area for new energy vehicle battery modules and PACK materials

Practical cases of operation and maintenance of liquid cooled data centers; Cold plate liquid cooling heat transfer enhancement technology, immersion liquid cooling heat transfer enhancement technology, two-phase flow (pumping) cooling technology, thermal simulation of data center liquid cooling system, and compatibility of immersion liquid cooling materials;

Quick connector technology, refrigerant and leakage detection technology, intelligent fluid distribution technology, and intelligent temperature monitoring technology;

Application of data centers: modular data centers, data cloud boxes, computer room solutions, batteries, energy storage, dedicated air conditioning and fresh air systems for computer rooms, UPS uninterruptible power supply, security, comprehensive cabling, green data centers, data center maintenance and other systems and solutions;

Battery materials: foam, ceramic silicone rubber, ceramic fiber, expansive coating, plastic foam, air gel, mica, PET film, ultra-fine glass wool, phase change materials and other thermal insulation insulation materials, thermal conductive structural adhesive, sealant, structural adhesive, thermal conductive adhesive, potting adhesive, foam adhesive, tape and other adhesive materials, PA, PBT, PP, PC, PC/ABS, PPO, PPE, PPS and other flame retardant polymer materials, SMC, PCM, HP-RTM Composite materials such as carbon fiber, aluminum alloy, high-strength steel, etc;

Battery equipment: PACK sorting, machine vision, welding, coating, assembly, testing, packaging, cutting, inspection, dispensing, gluing, etc.

• Telephone:13920329466
• Truename:Ms. Liu Yaping
• Mobile:13920329466
• Address:Shenzhen New International Expo Center

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