The 18th Beijing International Semiconductor Exhibition (CIOE Expo) in 2024

Time: June 19-21, 2024

Location: Beijing China International Exhibition Center (Chaoyang Hall)

Conference theme:

Innovation and integration lead to the future

Organizers: China Equipment Management Association, China Mechanical and Electrical Products Distribution Association, and Zhonggong Intelligent Technology Co., Ltd

Overseas support: Automated Imaging Association of the United States, European Machine Vision Association (EMVA), Japan Industrial Imaging Association (JIIA), German Machinery and Equipment Manufacturing Association - Machine Vision Professional Branch

Organizational units: Jinghe Exhibition (Beijing) Co., Ltd., Jingshang International Exhibition Co., Ltd

Exhibition Preface:

The 18th Beijing International Semiconductor Exhibition (CIOE EXPO) of 2024, jointly organized by the China Equipment Management Association, China Mechanical and Electrical Products Distribution Association, and Zhonggong Intelligent Technology Co., Ltd., and organized by Jinghe Exhibition (Beijing) Co., Ltd. and Jingshang International Exhibition Co., Ltd., will be held from June 19th to 21st, 2024 at the China International Exhibition Center (Chaoyang Hall) in Beijing; To build a comprehensive display and communication platform for the semiconductor industry.

The Beijing International Semiconductor Exhibition (CIOE EXPO) was founded in 2005 and has successfully held seventeen sessions. It is a regular event in the semiconductor industry; CIOE EXPO has witnessed the improvement of the level of China's semiconductor industry, promoted technological exchange and integrated development of the domestic and foreign semiconductor industry, and assisted in the prosperity of the domestic and foreign semiconductor technology and equipment markets. It is a grand event in China's semiconductor industry application industry, an important platform for showcasing new products and technologies annually, and an important window for communication with the world semiconductor technology and equipment industry; It has been regarded as an international feast by semiconductor technology equipment manufacturers and related service providers both domestically and internationally.

The rise of China's intelligent manufacturing industry, the shift of the global semiconductor electronics industry from vertical structure to horizontal structure, and the increasingly refined division of labor in the value chain have made China one of the main production bases for global semiconductor manufacturing, thereby promoting the rapid growth of China's semiconductor industry. To further enhance the development of the semiconductor industry, fully showcase the cutting-edge equipment and technology of the semiconductor industry, actively promote communication and interaction in the semiconductor industry, strengthen the awareness of communication and cooperation in the semiconductor industry, and achieve mutual promotion and common development.

The 18th Beijing International Semiconductor Exhibition (CIOE EXPO) in 2024 is a national, international, and professional industry event. The organizing committee strives to create a comprehensive exhibition promotion channel, efficiently utilizing traditional television media, newspapers, magazines, online media, WeChat, Weibo, and other emerging self media to continuously ignite the enthusiasm of enterprises to participate in exhibitions. The official WeChat platform of the exhibition now has a large number of professional fans, forming an interactive and timely sharing of exhibition and industry information, expanding the promotion and influence of the exhibition.

This exhibition will continue to increase publicity and promotion efforts, expand the scope of overseas exhibitions, and continuously improve the internationalization level of the exhibition; The organizing committee will also focus on strengthening the organization of audience for semiconductor equipment production enterprises, and build a platform for Chinese semiconductor equipment enterprises to go abroad.

2023 Summary

The 17th Beijing International Semiconductor Exhibition in 2023 was successfully held from July 5th to 7th at the China International Exhibition Center (Chaoyang Hall). Successfully attracted nearly 600 companies from 25 countries and regions around the world to participate in the exhibition. We have Yiheda Automation, Cognex Vision, Fluke Testing, Shangyin Technology, Yisa Automation, South China Instruments, Huatai Electronics, Xince Technology, Shuangcheng Technology, Jizhi Huiyi Technology, Zefeng Semiconductor, Lashen Optoelectronics, Zhizhen Precision, Chengye Hardware, Yaocheng Electronics, Feimian Instruments, Misemi, AVIC Optoelectronics, Amoxin China, Zhongda Diantong, Foxconn China, Zhidong Robotics, Jinggu Intelligence, and Gaode Zhigan Beijing Machine Tool Research Institute, Dachuan Heavy Industry, China Ordnance Equipment Group, Lingong Intelligence, Dongtu Technology, Zhenkunxing Industry, Utile Electric, Yinggang Trading, Orange Cloud Design, Emerson, SEW, the Business Department of the Austrian Embassy in China, Ubisoft, and Licon Yuantong Technology, among other well-known exhibitors with long-term cooperation. The exhibition attracted a total of 98200 professional visitors, with more than 600 enterprises forming a group to visit and purchase, with a professional audience of 95%, It is a large-scale and effective industry event from previous years.

Schedule

Registration and exhibition setup: June 17-18, 2024 (9-17)

Opening date: June 19, 2024 (9:30)

Exhibition time: June 19-21, 2024 (9-17)

Closing date: June 21, 2024 (16:00)

Dismantling time: June 21, 2024 (16:00-21:00)

Exhibition scope:

Semiconductor design, packaging and testing, manufacturing manufacturers

Raw materials: silicon wafers, silicon wafers, photoresists, photomask plates, electronic gases and special chemical gases, CMP polishing materials, photoresist materials, wet electronic chemicals, sputtering targets, sealing materials;

Production equipment: single crystal furnace, oxidation furnace, diffusion equipment, ion implantation equipment, PVD, CVD, lithography machine, etching machine, polishing machine, chamfering machine, gluing/developing machine, front-end testing equipment, wet process equipment, hot processing, coating equipment, single crystal deposition system, cleaning equipment;

Packaging process and equipment: thinning machine, slicing machine, SMT machine, soldering machine, plastic sealing machine, bending equipment, sorting machine, testing machine, robot automation, machine vision, other materials and electronic specialized equipment, etc

Testing and packaging supporting products: probe cards, lead bonding, welding testing, automated testing, laser cutting and other, grinding fluid, scratch fluid, sealing film (adhesive) high-temperature tape, laminated substrate, SMT adhesive, feeding plate, welding wire, flow control, quartz graphite, silicon carbide, etc;

Only the scope of the exhibition is filled in here, and contact information cannot be provided!

Please contact the exhibition organizer for implementation before participating in the exhibition.

• Telephone:18500732017
• Truename:Woking
• Mobile:18500732017
• Address:88 Yuxiang Road, Shunyi District, Beijing

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