2024 Chengdu 5G Terminal Exhibition | 2024 Chengdu 5G Base Station Functional Materials Exhibition

2024 China (Chengdu) International 5G Terminal and Base Station Functional Materials Exhibition

Time: July 17-19, 2024 Location: Chengdu Century City New International Convention and Exhibition Center

Exhibition information

Exhibition date: July 17-19, 2024

Exhibition cycle: once a year

Exhibition location: Chengdu Century City New International Convention and Exhibition Center

Exhibition Introduction:

With the advent of the 5G era and the demand for high-frequency and short wavelength signal transmission, base stations and 5G terminal equipment have put forward new requirements for a series of materials. High frequency and high speed, heat dissipation, electromagnetic shielding, filtering, appropriate dielectric constant, low dielectric loss, conductivity, high voltage, high current and other functional materials have ushered in broad market demand. The Shenzhen International 5G Terminal and Base Station Functional Materials Exhibition (CMF) aims to follow the trend of the 5G industry, promote the development of 5G, and win 5G business opportunities.

The 2024 China (Chengdu) International 5G Terminal and Base Station Functional Materials Exhibition, with the support of various units, will be grandly held from July 17 to 19, 2024 at the Chengdu Century City New International Convention and Exhibition Center. The exhibition is themed "Building and Sharing, Creating the Future", inviting academic experts and top entrepreneurs to participate, and building an exchange platform for information exchange and cooperation among industry peers and research institutes.

At the same time, a series of forward-looking, practical, and directional innovation and development summit forums and other seminars and activities will be held, inviting domestic and foreign experts and representatives to interact and exchange ideas, explore industry development trends, and share their respective experiences and achievements.

Review of the previous session:

The brands exhibited in the previous exhibition include Beijing Space Electromechanical Research Institute, Hushi, China Telecom, China Unicom, China Mobile, Haoyang, Huawei, ABB, ZTE, Shennan Circuit, 3M, Shimadzu, Mao Shuo Power, Sunshine Power, Shide Technology, Dingyang Technology, Chuangyuan Xinke, Shenglu Tongxin, Feirongda Technology, FiberHome Communication, Inspur Group, Wuhan Fangu, Guangdong Tongyu, Xi'an Huatian, Shengyi Technology, Dow Corporation, Zhongji Xuchuang, Sega Technology, Yufeng Power, Jiangsu Yongding, Wuhan Fangu, Wuhan Guangxun, Tianfu Communication, Ziguang Zhanrui, Dubang Technology, Sanfeng Technology 1. Libang New Materials, Shanghai Baigao, Huaneng Zhiyan, Xinyi Electronics, Litong, Sichuan Liufang Yucheng, Huazhong Technology, Nanyang Jingliang Optoelectronics, Bowei Optoelectronics, Anhui Rungu, Huizhou Shuobede, Shenzhen Science and Technology Innovation, Tongyu Communication, Shennan Circuit, Shanghai Electric Power Co., Ltd., Dafu Technology, Zhongtian Technology, Hengtong Optoelectronics, Nanjing Julong, Xiamen Naifu, Zhuhai Wantong, Suzhou Napan, Shenzhen Zhongsu, Guangdong Weidi, Wuhan Changfei, Zhongji Equipment, Bomin Electronics, Xinlun Technology, Aochuan Technology, Siquan New Materials, etc, 68612 visitors during the three-day exhibition period; There were a total of 108 peak forums during the same period, and 96 first-class media units reported on the exhibition. The successful holding of the exhibition has been highly recognized by relevant regulatory authorities.

Conference highlights:

In the 5G era, the exchange and collision of response measures among major material enterprises promote development

Elaborate and share on the properties and solutions of various currently popular materials

68612+industry professionals, 60+professional reports, seize the latest development opportunities

More than half of the products and end users, creating the most comprehensive docking opportunities

Approximately 90% of the audience is expected to be involved in procurement or related activities

Approximately 80+buyer tour groups are expected to visit and visit

Expected to host over 98+business matchmaking events organized by the organizers

◆ Time arrangement:

July 15, 2024: Space only booth construction and exhibitor setup

July 16, 2024: Construction of bare space booths and standard booths, exhibition arrangement

July 17, 2024: Exhibitor Entry/Opening Ceremony and VIP Visits/Professional Visits to the Exhibition

July 18, 2024: Exhibition/professional audience without lunch break

On the afternoon of July 19, 2024, exhibitors withdrew from the exhibition

◆ Audience group:

We focus on inviting communication operators, equipment manufacturers, component and processing companies (antennas, filters, heat sinks, fiber optic cables, copper clad panels, PCBs, base stations, etc.), material suppliers, equipment manufacturers, testing institutions, investment institutions, government industrial parks, development zones, consulting institutions, media, internet platforms, associations, chambers of commerce, etc. Personnel include product architects, ID designers, CMF designers, structural designers, etc Materials and process engineers, procurement, product managers, product planning, business supervisors, technical supervisors, investors, company executives, general managers, government leaders and other enterprise executives attended the meeting for visits and negotiations.

Exhibition reminder:

1. Without the consent of the organizing committee, exhibitors are not allowed to transfer their booths arbitrarily. Once discovered, their participation qualification will be revoked.

2. Exhibiting companies shall determine the area and select booths, fill out the detailed Exhibition Contract Form and stamp it with the official seal, and mail or scan a copy to the organizing committee.

3. After registration, exhibitors must remit the relevant fees to the designated account of the organizing committee within 3 working days.

4. The booth arrangement follows the principle of "registration first, payment first, and arrangement first", and the organizing committee has the right to adjust a small number of booths.

5G and smart terminals: intelligent transportation, smart business districts, smart homes, wearable smart devices, intelligent security, Internet of Things information security, big data processing, VRIAR, smart hardware, smart car related products and solutions, etc.

Microwave RF: Microwave components, communication equipment, microwave materials, microwave RF testing instruments, specialized software, etc.

Integrated Circuit: Third generation semiconductor devices and materials for integrated circuit design, chip processing, packaging and testing, semiconductor specific equipment and materials, integrated circuit product processors, memory, sensors, embedded products, automotive electronics, PMIC, etc., and intelligent power supply products.

5G high-frequency and high-speed materials and processing equipment: ceramic filters, ceramic powders, polishing equipment, conductive silver paste, silver baking and burning equipment, etc; Copper clad panels: PTFE, hydrocarbon resin, LCP liquid crystal polymer, PPO/PPE, etc; Antennas: PI, MPI, PPA, LCP, PPS, reflector precision machining equipment, etc; Various modified plastics used in 5G fiber optic cables, optical modules, optical components, connectors, etc.

Thermal conductive heat dissipation material film: graphite heat dissipation film, graphene heat dissipation film, etc; Coatings: High thermal conductivity coatings filled with graphene, carbon nanotubes, alumina, etc; Structural materials: copper, high thermal conductivity aluminum alloy, high thermal conductivity magnesium alloy, high thermal conductivity plastic, ceramics, etc; Interface materials: thermal conductive silicone grease, thermal conductive silica gel, double-sided adhesive, thermal conductive gasket, thermal conductive gel, liquid metal, phase change materials, etc; Radiator components and modules: heat pipes, heat plates, fans, heat sinks, thermoelectric converters, etc.

Electromagnetic shielding materials metal category: beryllium copper, stainless steel, etc; Filling type: conductive silicone, conductive plastic, etc; Surface coating category: conductive cloth, conductive coating, etc; Devices and modules: conductive plastic devices, conductive silicone, metal shielding devices, conductive cloth pads, etc.

Waterproof materials: motherboard waterproofing, component waterproofing, structural waterproofing, etc.

Special functions: photoelectric, adhesive, odor removal, self-cleaning, easy to clean, non stick, wear-resistant, high-temperature resistant, etc.

Please contact the exhibition organizer for implementation before participating in the exhibition.

• Telephone:150 0066 8073
• Truename:organizing committee
• Mobile:150 0066 8073
• Address:198 Century City Road, Wuhou District, Chengdu City, Sichuan Province

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