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2024 Shenzhen International Conductive Functional Materials and Electronic Paste Exhibition and Forum
Industry:

Communications / Electronics

Time:

2024/06/26 - 06/28 (Wed To Fri Total 3 Days)    Error Correction

Address:

Guangdong Shenzhen International Convention and Exhibition Center (New Hall) ChinaGuangdong ProvinceShenzhen CityBao'an District No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

Sponsor:

Shanghai Fulun Exhibition Co., Ltd

Organizer:

Shanghai Fulun Exhibition Co., Ltd

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INTRODUCTION

2024 Shenzhen International Conductive Functional Materials and Electronic Paste Exhibition and Forum - www.globalomp.com

2024 Shenzhen International Conductive Functional Materials and Electronic Paste Exhibition and Forum

2024 Shengzhen International Conductive Functional Materials&Electronic Paste Expo

Invitation letter

Location: Shenzhen International Convention and Exhibition Center Time: June 26-28, 2024

Organizer: Shanghai Fulun Exhibition Co., Ltd

Guidance unit: Magnesite Committee of Refractory Clay Committee of China Electronics Society, China New Materials Technology Association

Powder Technology Branch of China Building Materials Industry Association Electric Furnaces and Industrial Furnaces Branch of China Electrical Appliance Industry Association

Powder Metallurgy Industry Technology Innovation Strategic Alliance National Advanced Functional Fiber Innovation Center

China Electronics and Circuit Industry Association, Electronic Materials Branch of China Electronics Society

Exhibition Introduction:

Electronic paste has been widely used in various fields of the electronic industry, such as capacitors, potentiometers, thick film hybrid integrated circuits, sensitive components, and surface assembly technology. The surface of base metal powder is often covered with an oxide film, which is almost non-conductive. Especially under atmospheric conditions, oxidation becomes more severe after high-temperature burning, which limits the application of base metals in the field of electronic pastes. However, with the sharp increase in precious metal prices, the cost of electronic pastes continues to rise. Moreover, certain base metal materials have superior performance in some fields compared to precious metals. Aluminum and silicon are prone to form PN junctions with long wave response characteristics. Aluminum conductor slurry is selected as the material for the back field of single grade silicon solar cells used on the ground; Aluminum and nickel zinc have good ohmic contact characteristics and good aging properties on PTC thermistor ceramics. Aluminum slurry, nickel slurry, and zinc slurry are selected as electrode materials for PTC thermistors. Copper has superior high-frequency characteristics and conductivity compared to gold, and there are no defects in silver ion migration, making copper conductor paste a good material for microwave and microelectronic circuits. The sputtering phenomenon of silver electrodes on plasma display panels is quite serious. Replacing silver conductor slurry with nickel conductor slurry can overcome these shortcomings and greatly extend the lifespan of plasma display panels. Due to the unique advantages of base metals, the development of base metal conductor slurries with high-temperature sintering behavior has attracted widespread attention.

The 2024 Shenzhen International Conductive Functional Materials and Electronic Paste Exhibition and Forum will be held from June 26th to 28th, 2024 at the Shenzhen International Convention and Exhibition Center; The theme exhibition of the 12th Shenzhen International Thermal Conductive and Cooling Material Equipment Exhibition in 2024 is the 2024 Shenzhen International Conductive Functional Materials and Electronic Slurry Exhibition Zone. Multiple technical seminars and forums will be held simultaneously, and domestic and foreign experts and representatives will be invited to interact and exchange ideas to explore industry development trends. At that time, we warmly welcome domestic and foreign enterprises and related industry professionals to visit and exchange ideas!

Exhibition time:

Reported Exhibition: June 24-25, 2024 Opening Ceremony: June 26, 2024

Exhibition display: June 26-28, 2024. Withdrawal: June 28, 2024


Scope

1、 Conductive materials: carbon based, metal based, metal oxide based, structural polymer based/composite based, etc

Carbon based conductive materials: electric carbon black, graphite, carbon fiber, conductive ink, conductive adhesive, carbon nanotube materials, graphene

Metal based conductive materials: Silver based, copper based, nickel based and other conductive metal powder materials; There are conductive metal oxides such as antimony doped tin dioxide (ATO), aluminum doped zinc oxide (ZAO), indium doped tin oxide (ITO), etc; Structural conductive polymer materials; Composite conductive materials, etc;

1. Nano metal powders: nano silver powder, nano copper powder, nano iron powder, nano cobalt powder, nano nickel powder, nano zinc powder, nano gold powder, etc;

2. Nano oxide powders: nano titanium oxide, nano silicon oxide, nano zinc oxide, nano iron oxide, nano alumina, nano zirconia, nano nickel oxide, etc;

2、 Electronic slurry: conductor slurry (silver slurry, aluminum silver slurry), dielectric slurry, resistance slurry, conductive slurry, tungsten slurry, polymer slurry, thin film electronic slurry, molybdenum manganese slurry, conductive silver slurry, thermal conductive slurry, heating slurry, encapsulation slurry, electrode slurry, ceramic slurry, thick film slurry, silver slurry, aluminum slurry, specialized electronic slurry (stainless steel substrate electronic slurry, thermistor slurry) Metal electronic slurries (such as silver palladium, ruthenium based and gold slurries, molybdenum manganese slurries, etc.), heat-resistant slurries, substrate slurries, battery slurries, thick film electronic slurries, and other slurries;

1. Metal (copper, nickel, silver, gold, palladium) electronic pastes

2. Additives: pigments/pigments, masterbatch, curing agent, glue, dispersant, wetting agent, melt changing agent, treatment agent, debonding agent, catalyst, binder, solvent and other additives;

3. Manufacturing process technology equipment: pulping treatment equipment, leveling, drying, sintering, separation and filtration equipment, grinding equipment, dispersion equipment, mixing equipment, mixing equipment, purification equipment, grading equipment, drying equipment, grinding medium equipment, conveying equipment, forming equipment, selection equipment, crushing equipment, degassing pre-treatment, packaging, analysis/inspection, environmental protection treatment, etc.


Costs & Precautions

Please contact the exhibition organizer for implementation before participating in the exhibition.

2024 Shenzhen International Conductive Functional Materials and Electronic Paste Exhibition and Forum - www.globalomp.com


Contact

  • Telephone:13916473058
  • Truename:Mr. Li
  • Mobile:13916473058
  • Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

Disclaimer

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870

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