With the sustained and strong development demand in fields such as 5G, consumer electronics, automotive electronics, new energy vehicles, and semiconductors, new development requirements have been put forward for the quality and quantity of precision ceramics. The rapid development of precision ceramic MLCC chip multilayer ceramic capacitors, LTCC low-temperature co fired ceramics, HTCC high-temperature co fired ceramics, ceramic substrates, ceramic copper clad plates, precision structural ceramics, piezoelectric ceramics, semiconductor ceramics and other products has greatly promoted the progress of various industries, with rapid progress in quantity and quality. The market itself holds great potential. Has broad development space. Faced with increasingly fierce competition in the international market, enterprises need to constantly absorb new knowledge and technology, adjust their product production and sales concepts appropriately, and respond to the current development pattern.

In order to promote the upgrading and development of the precision ceramics and IGBT industry chain, strengthen communication and contact with industry purchasers, and promote technological upgrading and transformation, the 2024 Shenzhen International Precision Ceramics and IGBT Industry Chain Exhibition, hosted by Bohan Exhibition and Liyue Exhibition, will be held simultaneously. The 12th Shenzhen International Thermal Conductive and Cooling Materials and Equipment Exhibition will be held from June 26 to 28, 2024 at the Shenzhen International Convention and Exhibition Center. The exhibition will focus on showcasing new products and technologies in the precision ceramics and IGBT industry chain, establishing a brand image for enterprises, promoting trade cooperation and market development, leading industry trends, strengthening production, research and development, and sales interaction, gaining a deep understanding of the new trends in the future development of precision ceramics and IGBT industry chain markets at home and abroad, and exploring new demands in the future precision ceramics and IGBT industry chain markets with a development perspective, innovating the connotation of the exhibition, comprehensively Organizing professional audiences at multiple levels provides a great platform for exhibitors and merchants to exchange technology, showcase products, and negotiate trade. At that time, we warmly welcome domestic and foreign precision ceramics and IGBT industry chain enterprises and related industry professionals to visit and exchange ideas!

Target audience: We will focus on inviting executives from national, provincial, municipal, and relevant research institutions in the fields of 5G, consumer electronics, communication, electronic appliances, automotive electronics, new energy vehicles, semiconductors, aerospace, industrial machinery and equipment, artificial intelligence, automobiles (motorcycles), textiles, environmental protection, medical equipment, new energy, and other related fields to visit and negotiate procurement.

Exhibition of Precision Ceramics and IGBT Industry Chain in China? Shenzhen looks forward to your enthusiastic participation!

1. Ceramic devices and materials: MLCC, LTCC, HTCC, microwave dielectric ceramics, piezoelectric ceramics, barium titanate, barium carbonate, titanium oxide, alumina, zirconia, glass powder, aluminum nitride, LTCC dielectric ceramic powder, rare earth oxides, ceramic strips, etc;

2. Precision ceramics: zirconia, alumina, aluminum nitride, silicon nitride, silicon carbide, yttrium oxide, structural ceramics, high-temperature ceramics, transparent ceramics, ceramic microbeads, new energy ceramics, ceramic bearings, ceramic balls, semiconductor ceramics (handling arms, ceramic cleavers, electrostatic chucks, etching rings...), 3D printed ceramics, fuel cell (SOFC) diaphragms, wearable ceramics, fiber optic ceramic inserts, ceramic sleeves, CIM Bioceramics, etc.

3. Ceramic substrate and packaging shell: ceramic packaging shell, DPC, DBC, AMB, HTCC substrate, LTCC substrate, thin film circuit board, thick film circuit board, ceramic packaging base, heat sink, alumina, aluminum nitride, silicon nitride, beryllium oxide, mullite powder and substrate, etc;

4. Metal materials: silver powder, gold powder, copper powder, nickel powder, solder (solder pads, solder paste), MLCC inner/outer electrode slurry, LTCC silver slurry, gold slurry, tungsten molybdenum slurry, copper slurry, target material, oxygen free copper strip, kovar alloy, metal stamping parts, etc;

5. Additives: dispersants, adhesives, plasticizers, flocculants, mineralizers, defoamers, lubricants, sintering aids, etc. for ceramics and conductive slurries;

6. Ceramic processing equipment: sand mill, ball mill, vacuum defoaming machine, three roll machine, spray granulator, dry press, tape casting machine, injection molding machine, 3D printer, mold, drying equipment, grinding machine, precision engraving machine, cutting machine, laser equipment, punching machine, hole filling machine, screen printing machine, laminating machine, laminating machine, isostatic press, hot cutting machine, leveling machine, glue discharge furnace, sintering furnace, brazing equipment, electroplating equipment, chemical plating Silver spraying machine, silver immersion machine, silver terminal machine, vacuum coating equipment, developing equipment, film removal equipment, etching machine, wet process equipment, plasma cleaning, ultrasonic cleaning, automation equipment, peel strength tester, AOI testing equipment, marking machine;

2、 IGBT industry chain:

2. 1. Materials: silicon carbide, ceramic lining plate (DBC, AMB), packaging shell, bonding wire, heat dissipation base plate (copper, aluminum silicon carbide AlSiC), thermal conductive silicon gel, epoxy potting adhesive, solder (prefabricated solder), silver film/silver paste, radiator (copper, aluminum), power outlet terminal (copper terminal), shell (engineering plastic PPS, PBT, high temperature nylon), cleaning agent, etc;

2. 2. Equipment and accessories: vacuum welding furnace, SMT machine, solidification machine, wire bonding machine, X-ray, push-pull testing machine, plasma cleaning equipment, dispensing machine, screen printing machine, ultrasonic scanning equipment, dynamic and static testing machine, dot/filling machine, silver sintering equipment, vertical solidification furnace, formic acid vacuum eutectic furnace, automatic capping equipment, high-speed needle insertion machine, bending equipment, ultrasonic welding machine, visual inspection equipment Push and pull testing machines, high and low temperature impact equipment, power cycle testing equipment, marking machines, inspection platforms, fixtures, etc;

• Company:Bohan Exhibition (Shenzhen) Co., Ltd
• Truename:Zhang Desong
• Mobile:18930491940
• Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870