The 2024 Shenzhen Semiconductor Exhibition will be held on May 15th, 2024

2024 China (Shenzhen) International Semiconductor Exhibition

Time: May 15-17, 2024

Location: Shenzhen International Convention and Exhibition Center (Bao'an New Hall)

Conference theme: Xinlian World Huichuang Future

》》》Development prospects:

The importance of the semiconductor industry is self-evident. It is the foundation of various high-tech upgrades and permeates into various top technology fields. China is a major consumer of semiconductors, accounting for one-third of global consumption each year, with imports reaching as high as 300 billion US dollars, which is even higher than China's crude oil imports. The Chinese government's support for the semiconductor industry has been consistent, and as early as 2015, several industries, including semiconductors, were included in its "Made in China 2025" plan for strong support. The Outline for Promoting the Development of the National Integrated Circuit Industry states that by 2030, the main links of the integrated circuit industry chain must reach the international advanced level, and a group of enterprises should enter the international first tier.

In addition, the government also heavily supports the development of the semiconductor industry. The first phase of the National Integrated Circuit Industry Investment Fund, operated by the National Integrated Circuit Industry Investment Fund Co., Ltd., which shoulders the heavy responsibility of supporting China's local chip industry, has a registered capital of 98.72 billion yuan and a total investment scale of 138.7 billion yuan. In the investment project, chip manufacturing accounts for 67%, chip design accounts for 17%, packaging and testing accounts for 10%, and equipment and materials account for 6%. The registered capital of the second phase of the large fund has reached 204.15 billion yuan. In terms of investment direction, in addition to continuing to support the manufacturing sector, it is expected to focus on high-end equipment and new materials.

In the past few decades, the development of first and second generation semiconductors has achieved the success of large enterprises in Europe, America, Japan, and South Korea. The efforts of the Chinese government and industry are expected to enhance China's position and voice in the latest generation of semiconductors. The huge demand and limited supply capacity have created great space for the development of the semiconductor industry in China. Despite the unpredictable external environment, semiconductors remain an industry with long-term development potential, and this trend will continue to be maintained in the coming years.

In order to better promote the development of the semiconductor industry, with strong support from national regulatory authorities at all levels, the 2024 China (Shenzhen) International Semiconductor Exhibition will be held grandly from May 15 to 17, 2024 at the Shenzhen International Convention and Exhibition Center (Bao'an New Hall). The exhibition will be held with the aim of "highlighting brand, exploring innovation, and focusing on practical results". With unique creativity, scientific and reasonable integration and excellent services, and a new concept, we will provide exhibitors with a "high-level, high-grade, and high-quality" display and communication stage, creating the largest, most valuable, and authoritative top-level event in the semiconductor industry. We look forward to your participation in this exhibition.

》》》Reason for participation:

※ Scale advantage, meeting new distributors and buyers: providing strong guarantee for the actual exhibition effect of exhibitors. This exhibition is expected to have over 50000 attendees, adopting a strong global investment promotion model. The database of previous exhibitions will be integrated, with a focus on inviting semiconductor industry users to visit and negotiate.

※ Seamless integration, inviting domestic and foreign merchants: there are advertising signs in the exhibition hall, subway stations, and hotels, and more than 500 full-time foreign language personnel are arranged to directly introduce professional purchasers involved in the exhibition field to our exhibition site for procurement negotiations.

※ Expand the market and consolidate existing market share: Enjoy comprehensive online and offline promotion throughout the year with one exhibition, covering new media methods such as websites, magazines, newspapers, mobile newspapers, Weibo, WeChat, etc. Multiple surprises can be achieved with one exhibition. Stay up to date with the latest market developments, share and interact, and set up a one-on-one trade matching meeting. We sincerely invite procurement leaders from both online and offline semiconductor industry users, with audiences from more than 30 countries and regions around the world, to arrange one-on-one meetings and negotiations, which is an excellent way to improve your product sales.

》》》100 media outlets track and report throughout the entire process:

This exhibition places great emphasis on shaping and promoting the brand of exhibitors. By inviting central media, mainstream financial media, large portal websites, industry media, and overseas media to provide comprehensive, multi angle, and three-dimensional coverage of exhibitors, we aim to maximize the promotion of the latest products and technologies to global buyers and create unlimited business opportunities for exhibitors! This exhibition will invite hundreds of industry media outlets, including CCTV, Xinhua News Agency, China Business Daily, China Securities News, Securities Times, Phoenix Net, Sohu, NetEase, Sina, Tencent, etc., to report on site.

》》》Advantages of the Greater Bay Area:

As China's manufacturing industry has shifted from high-speed growth to high-quality development, since 2013, the Chinese government has successively announced and promoted the "the Belt and Road" initiative and the construction of the "the Belt and Road" Greater Bay Area. The goal is to establish a new economic and trade partnership with countries along the "Belt and Road". At home, through the "Guangdong, Hong Kong and Macao Greater Bay Area", the Chinese government has accelerated the construction of a modern industrial system and multilateral open markets to drive high-quality development through continuous innovation.

The construction of the "Guangdong Hong Kong Macao Greater Bay Area" refers to the development of nine cities in Guangdong Province (including Guangzhou, Shenzhen, Zhuhai, Foshan, Huizhou, Dongguan, Zhongshan, Jiangmen and Zhaoqing) and two special administrative regions of Hong Kong and Macao into world-class city groups and international scientific and technological innovation centers with global influence. By deepening cooperation between Guangdong, Hong Kong and Macao and giving full play to their respective advantages, the Greater Bay Area will promote the coordinated development of regional economy and become the "the Belt and Road" An important support for building a new platform for international economic cooperation. In 2019, the GPD of the Greater Bay Area reached RMB 11.6 trillion, and it is expected to reach RMB 28.9 trillion by 2030, ranking among the top ten economies in the world.

The Guangdong Hong Kong Macao Greater Bay Area gathers high-quality resources from two regions, one province, and nine cities. It will be built into an international science and technology innovation center with global influence, a world-class advanced manufacturing and strategic emerging industry cluster area, and the fourth world-class bay area after New York, San Francisco, and Tokyo, Japan.

The most innovative and open urban agglomeration, with enormous development potential, is a gathering place for traditional manufacturing industries such as automobile manufacturing, new energy vehicles, semiconductors, household appliances, consumer electronics, electronic information and equipment manufacturing, 5G materials, intelligent manufacturing, high-performance materials, energy conservation and environmental protection, etc.

》》》Exhibition scope:

1. Semiconductor equipment and intelligent equipment: packaging equipment, diffusion equipment, welding equipment, cleaning equipment, testing equipment, refrigeration equipment, oxidation equipment, thinning machine, slicing machine, SMT machine, single crystal furnace, oxidation furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, polishing machine, chamfering machine, ion injection equipment, CVD/PVD equipment, coating/developing machine, front-end testing equipment, wet process equipment, thermal processing, coating equipment Single crystal deposition system, solidification machine, plasma cleaning equipment, cutting machine, loading machine, bonding machine, wire bonding machine, plastic sealing machine, reflow soldering, wave soldering, testing machine, bending equipment, sorting machine, robot automation, machine vision, other materials and electronic special equipment, coupling machine, carrier molding machine, testing equipment, constant temperature and humidity test box, sensor, packaging mold, testing fixture, precision slide table, stepper motor Valves, probe stations, cleanroom equipment, water treatment, etc

2. Wafer manufacturing and packaging: wafer manufacturing, advanced SiP packaging, OSATs, EMS, OEMs, IDMs, silicon wafer and IC packaging carriers, printed circuit boards, packaging substrates and equipment, assembly and testing, packaging design, testing, equipment and application manufacturing and packaging, EDA, MCU, printed circuit boards, etc;

3. Packaging and testing supporting equipment: testing probe table, probe card, testing machine, sorting machine, packaging equipment, packaging substrate, lead frame bonding wire, lead bonding, welding testing, automated testing, laser cutting and other, grinding fluid, scratching fluid, high-temperature sealing film (adhesive) tape, laminated substrate, SMT adhesive, feeding plate, solder wire flow control, quartz graphite, silicon carbide, etc;

4. IC design: IC and related electronic product design, IC product and application technology, IC testing methods and instruments, IC design and design tools, IC manufacturing and packaging, EDA, IP design, embedded software, digital circuit design, analog and mixed signal circuit design, integrated circuit layout design, IDM, Fabless factory, etc;

5. Integrated circuits: wafer manufacturing plants, wafer foundries, analog integrated circuits, digital integrated circuits, mixed digital and analog integrated circuit manufacturing, integrated circuit terminal products, etc;

6. Semiconductor materials: silicon wafers and silicon-based materials, silicon wafers, silicon wafers, monocrystalline silicon, silicon wafers, germanium silicon materials, S01 materials, silicon materials and compound semiconductor materials for solar cells, quartz products, graphite products, anti-static materials, photoresists and their supporting reagents, wafer tapes, photomask plates, electronic gases, special chemical gases, CMP polishing materials, packaging substrates, lead frames, bonding wires, packaging materials Ceramic substrates, chip bonding materials, photoresist materials, wet electronic chemicals, sputtering targets, sealing materials, slicing, grinding, polishing, thin films, etc;

7. Third generation semiconductors: Third generation semiconductors such as silicon carbide SiC, gallium nitride GaN, wafers, substrates, packaging, testing, optoelectronic devices (light-emitting diodes LED, laser LD, detector UV), power electronic devices (diodes, MOSFET, JFET, BJT, IGBT, GTO, ETO, SBD, HEMT, etc.), microwave and radio frequency devices (HEMT, MMIC, etc.);

8. Electronic components: resistors, capacitors, potentiometers, electronic tubes, heat sinks, electromechanical components, connectors, semiconductor discrete devices/IGBT, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectric, crystal, quartz, ceramic magnetic materials Printed circuit substrates, electronic functional process specific materials, electronic adhesive (tape) products, electronic chemical materials and components, passive devices, 5G core components, special electronics, components, power management, storage, connectors, cables, plug-in devices, crystal oscillators, resistors, potentiometer magnetic components, filtering components, PCB boards, motor fans, electroacoustic devices, display devices, diodes, transistor filtering components, etc;

》》》Sponsorship Program:

In order to facilitate well-known enterprises to leverage the international influence of this exhibition, showcase their strength, and enhance their brand image, the organizing committee has set up a special exhibition sponsorship plan. An efficient sponsorship program will bring you more business opportunities and enhance your participation before, during, and after the exhibition.

Four levels are specially designated: Diamond, Platinum, Gold, and Silver (detailed plans are available upon request). Sponsors will receive the following benefits:

Obtaining higher exposure rates through effective market exposure by reaching more target customers than competitors

Participate in industry events as industry leaders to enhance brand image and awareness

Establishing a sales network through a new platform, increasing trade opportunities, and obtaining more information on buyers and professional sellers

》》》Exhibition reminder:

1. Please fill out the "Exhibition Application and Contract" form carefully and stamp it with the official seal before returning it to the organizing committee.

2. After applying for a booth, exhibitors are required to wire transfer the booth fees to the designated account of the conference within 3 working days. After the remittance, the remittance receipt should be returned to the organizing committee for verification; If payment is not made in a timely manner within the specified time, the organizing committee will not retain the original booth.

3. Principle of booth allocation: "Apply first, pay first, and arrange first".

4. In order to ensure the overall image of the conference, the organizing committee reserves the ultimate right to adjust some of the exhibitors' booths.

》》》Contact information of the organizing committee:

Postal code: 201908

Phone: 021-54338308

Contact person: Chen Wanli

• Telephone:021-54338308
• Truename:Chen Wanli
• Mobile:021-54338308
• Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

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