Shenzhen Semiconductor Exhibition, Semiconductor Exhibition, Shenzhen Semiconductor Exhibition, Semiconductor Industry Exhibition, Semiconductor Equipment Exhibition, Shenzhen Semiconductor Industry Exhibition, Shenzhen Semiconductor Equipment Exhibition

The 6th Shenzhen International Semiconductor Technology and Application Exhibition in 2024

Time: June 26-28, 2024

Mr. Pu: I86 OI62 6297

Location: Shenzhen International Convention and Exhibition Center

Exhibition area: 60000 square meters Exhibition enterprise: 800 professional visitors, expected 60000 people

Exhibition Introduction:

The 6th SEMI-e Shenzhen International Semiconductor Technology and Application Exhibition will be held at the Shenzhen International Convention and Exhibition Center (Bao'an New Hall) from June 26th to 28th, 2024. The theme of this exhibition is "Chip Opportunities · Smart Future", bringing together numerous industry experts and scholars to further strengthen exchanges and cooperation in the global integrated circuit industry. Focusing on China's international integrated circuit industry and applications, based in Shenzhen and radiating across the country, the aim is to concentrate on showcasing the development achievements of the integrated circuit industry, accelerate breakthroughs in key links of the industrial chain such as high-end chip design, key components, core equipment materials, and EDA design tools, strengthen cooperation in the Pearl River Delta industrial chain, gradually form a comprehensive integrated circuit industry cluster, and create a platform for exchange and trade in the integrated circuit industry in South China, Promote the faster and better development of the South China Integrated Circuit Industry Cluster.

This exhibition is in line with the trend of industrial development and serves applications in more than ten emerging industries. The exhibition covers an area of 60000 square meters and will gather over 800 exhibitors to showcase the semiconductor industry chain, which includes integrated circuits, electronic components, third-generation semiconductors, materials and equipment in the industry chain. Multiple peak forums were held simultaneously, with over 60000 visitors covering fields such as integrated circuits, 5G applications, automotive electronics, industrial electronics, medical electronics, Internet of Things, consumer electronics, smart home appliances, new displays, industrial interconnection, intelligent manufacturing, artificial intelligence, and wireless charging.

Exhibition scope:

Exhibition Area for Design, Chip, Wafer Manufacturing and Packaging
Integrated circuit design and chip, wafer manufacturing, advanced SiP packaging, power device packaging and testing, MEMS packaging and testing, silicon wafer and IC packaging carrier board, packaging substrate and application manufacturing and packaging testing, EDA, MCU, packaging substrate semiconductor materials and equipment and components, etc
Semiconductor specific equipment&components exhibition area
Thinner, single product furnace, grinder, heat treatment equipment, lithography machine, etching machine, ion implantation equipment, CVD/PVD equipment, cleaning equipment, cutting machine, loading machine, bonding machine, testing machine, sorting machine, probe table and components, etc
Advanced Materials Exhibition Area
Silicon wafers and silicon-based materials, photomask templates, electronic gases, photoresists and their supporting reagents, CMP polishing materials, targets, packaging substrates, lead frames, bonding wires, ceramic substrates, chip bonding materials, etc
Third generation semiconductor exhibition area
Gallium nitride (GaN) and silicon carbide (SiC), zinc oxide (ZnO), diamond, wafer, substrate and epitaxy, power devices, IGBT packaging materials, RF devices and processing equipment, etc
IC carrier board/ceramic substrate exhibition area
Chiplet packaging technology, storage, MEMS and chip applications, materials and equipment for IC carrier boards and packaging processes (structural materials such as substrates and copper foil, as well as chemicals/consumables such as dry films and gold salts). Ceramic substrates, packaging materials and equipment, etc
Component exhibition area
Passive devices, semiconductor discrete devices/IGBT, 5G core components, special electronics, and components. Power management, sensors, storage devices, connector relays, cables, plug-in devices, crystal oscillators, resistors, display devices, diodes, transistor filtering components, switches and component materials and equipment, etc
Semiconductor Display/Mini/Micro LED Exhibition Area
OLED, AMOLED, Mini/Micro LED displays, flexible displays and materials and equipment, etc
Machine Vision and Sensor Exhibition Area
Various sensing components, actuators, intelligent sensors, industrial sensors, sensor chips, sensor production and manufacturing equipment, accessories, etc
Power&Energy Storage Technology Exhibition Area
Energy storage power supplies and sensors, battery management chips, power semiconductor devices and materials, and related equipment, instruments and components, etc
AI and computing power, algorithms, storage, and CPO co package exhibition area
Artificial intelligence chips, solutions, computing power chips and solutions, algorithm solutions, data storage, optoelectronic co packaging modules and technologies and equipment, etc
Millimeter wave radar/LiDAR/Autonomous driving exhibition area
Products in the upstream and downstream supply chain of automotive radar sensors, including millimeter wave radar modules, RF chips, antennas and high-frequency PCBs, high-frequency materials, production and assembly equipment, etc
Exhibition area for advanced automotive semiconductor/automotive grade packaging technology
Automotive grade semiconductor control/computing chips, power semiconductors (IGBT and MOSFET), automotive grade SiC modules, power management chips, automotive electronic micro assembly and power devices, packaging testing equipment, automation equipment, etc
Microelectronics Integrated Intelligent Manufacturing Zone Electronic Automation, Machine Automation, Visual Inspection, Environmental Protection, Cleaning Equipment, Testing Equipment, Testing Instruments, Accessories, etc
International semiconductor material suppliers, well-known equipment suppliers, well-known packaging and testing, manufacturing, and OEM manufacturers in the international brand area

• Company:Shanghai Qixuan Exhibition Co., Ltd
• Telephone:18601626297
• Truename:Mr. Pu
• Mobile:18601626297
• E-mail:1159191983@qq.com
• Address:Fengxian District, Shanghai

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