2024 IC Carrier Board and Ceramic Packaging Technology Industry Chain Exhibition and Summit in Shenzhen

Exhibition time: June 26-28, 2024 Exhibition location: Hall 4/6/8, Shenzhen International Convention and Exhibition Center

Organizer:

China Communications Industry Association

Jiangsu Semiconductor Industry Association

Zhejiang Semiconductor Industry Association

Shenzhen Semiconductor Industry Association

Chengdu Integrated Circuit Industry Association

Undertaking unit:

Shenzhen Zhongxin Materials Exhibition Co., Ltd

Investment unit:

Shanghai Yingdu Exhibition Co., Ltd

SEMI-e Exhibition Introduction:

The 6th SEMI-e 2024 Shenzhen International Semiconductor Technology and Application Exhibition (abbreviated as SEMI-e), with the theme of "computing in the chip" and "enjoying the future with intelligence", covers an exhibition area of 60000 square meters. This exhibition will invite more than 800 exhibitors in the fields of chip design, wafer manufacturing, packaging testing, materials and equipment, and core components to participate. It is an influential and representative industry exhibition in the domestic semiconductor field, focusing on various latest application solutions in semiconductor sub sectors such as IC carrier boards and ceramic packaging, third-generation semiconductors, IGBT, Al computing power, algorithms, storage, power and energy storage, millimeter wave radar and autonomous driving, Mini/Micro LED, etc. This exhibition will build a platform for precise supply and demand docking and two-way cooperation for the upgrading and development of the industrial chain, explore new paths for the development of the semiconductor industry, and jointly explore new trends in the semiconductor industry! The expected number of viewers is over 60000.

With the sustained and strong development demand in the fields of household appliances, communication, computer industry, automotive electronics, new energy vehicles, semiconductors, etc., this exhibition will hold the 2024 IC Carrier and Ceramic Packaging Technology Industry Chain Exhibition and Summit at the same time. It will focus on the IC Carrier and Packaging Technology (structural materials such as substrates and copper foils, as well as chemicals/consumables such as dry films and gold salts) industry, with a focus on showcasing Chiplet packaging technology, storage, MEMS and chip applications, ceramic components, ceramic substrates, structural ceramics, ceramic materials, metal materials, equipment, consumables, and other full industry chain product solutions.

The previous SEMI-e exhibition had an area of over 40000 meters and held over 40 themed events during the same period, attracting 40757 people from the semiconductor industry, automotive new energy, consumer electronics, medical and industrial control fields to visit and exchange ideas, with a total of 73646 visitors. 643 companies, including Changdian Technology, Huatian Technology, Tongfu Microelectronics, Huajin Semiconductor, Jiejie Microelectronics, Jintaike, Heketai, Peidun, Sanhuan Group, BYD Microelectronics, Tianxin Interconnection, Shi Creativity, Jiangbolong, and industrial chain materials and equipment, showcased new technologies, products, highlights, and trends in the semiconductor industry, building a new ecosystem of communication and integration in the semiconductor industry. Among them, Huawei, ZTE, SMIC, Yuexin, Huahong Group, Sanan Optoelectronics, Shunluo Electronics, Changjiang Storage, China Resources Microelectronics, Zhaoyi Innovation, Sun and Moon, Silan Microelectronics, Suzhou Guqin, Yangjie Electronics, Ankai Packaging, Yongsi Electronics, Jingdao Microelectronics, Baiwei, Sichuan Mingtai, Chongqing Pingwei, Pingjing Microelectronics, Huayu Electronics, Kongjia Xinying Semiconductor, Huanxu Electronics, Fuman Electronics, Fangzheng Microelectronics Representatives from professional buyers such as Jinyu Semiconductor, Shennan Circuit, Qipai Technology, ZTE Microelectronics, Jiequn Electronics, Dinghua Xintai, Zhuhai Yueya, Xingsen Technology, Dongshan Precision, Chongda Technology, and Zhongjing Electronics all attended this exhibition to explore the charm of technology from zero distance and assist in the innovative development of the semiconductor industry.

Previous Review:

The SEMI-e exhibition covers an area of over 40000 meters and gathers 643 exhibitors. The exhibits cover seven major fields: electronic components, IC design&chips, wafer manufacturing and packaging, Mini/Micro LED, semiconductor equipment, semiconductor materials, and third-generation semiconductors. During the same period, more than 40 themed events were held, attracting 40757 people from the semiconductor industry, automotive new energy, consumer electronics, healthcare, and industrial control to visit and exchange, with a total of 73646 visitors. Changdian Technology, Huatian Technology, Tongfu Microelectronics, Huajin Semiconductor, Jiejie Microelectronics, Jiangbolong, BYD, Sanhuan Group, Shi Creativity, Jintaike, Duntai Technology, Heketai, Peidun, Wuxi Xinxiang, InnoTech, Basic Semiconductor, Gallium Future, Tianyu Semiconductor, Shuo Ke Crystal, Hantiancheng, Hebei Puxing, Senguoke, Gallium Future, Jiangsu Nenghuawei, Juneng Chuangxin, Shengguang Silicon Research, Shanghai Microelectronics Equipment Huagong Laser, Kaige Precision Machinery, Xinyichang Kaijiu, Jintuo/Silikon, Yuhuan CNC, Liande Semiconductor, Keenshi, High Vision, Vision Technology, Hunting Intelligence, Zhengye Technology, Aisin, Hanhong Precision, Nashe Intelligence, Sitek, Ennaki, Meiji Sensors, THK, Huazhuo Jingke, Senmei Xier and other enterprises all comprehensively showcased the new technologies, products, highlights, and trends of the semiconductor industry at this exhibition, Build a new ecosystem of communication and integration in the semiconductor industry. Among them, companies such as Ansei Semiconductor, BYD Semiconductor, Foxconn, Huawei, Jiade New Energy, Yake Electronics, ZTE Communication, and Changan New Technology visited the site, as well as Yangjie Technology, Dongwei Semiconductor, Star Semiconductor, SMIC, Infineon, CRRC Times, Tianke Heda, Changjiang Storage, China Resources Micro, GAC Group, Intel, Microsoft China, Tencent, BYD, Ansemy, Donglong Automobile, and Xiaomi Automobile FAW Toyota, Cambrian, Ziguang Zhanrui, Zhongxin Microelectronics, Horizon, Zhongkexin (the 58th Research Institute of China Electronics Corporation), Zhaoyi Innovation, CR Microelectronics, Huahong, Shengbang Microelectronics, New Jieneng, Jichuang North, TCL Huaxing, Sanan Optoelectronics, CRRC Times, Tianke Heda, Shilan Microelectronics, Riyuguang, Pingtouge, Yifa Semiconductor, Volkswagen, Sony, OPPO, China Electric Construction Group Jiangxi Electric Construction, and Tianyue Advanced Representatives of professional buyers from Time Electric and others attended this exhibition to explore the charm of technology from zero distance and assist in the innovative development of the semiconductor industry.

SEMI-e Simultaneous Summit:

The Semiconductor Application Summit is a conference forum that brings together experts from the upstream and downstream of the semiconductor industry, industry research institutions, and other industries to exchange information and share insights. It allows industry elites to interact with each other from zero distance and comprehensively interpret the development model and trends of China's semiconductor industry.

The 5th Third Generation Semiconductor Industry Development Summit Forum

2024 IC Carrier Board and Ceramic Packaging Technology Industry Summit

China Domestic Semiconductor Equipment and Materials Development Forum

The 2nd Artificial Intelligence - Computing Power, Algorithms, and Energy Storage Conference and Exhibition in 2024

Highlights of the 6th SEMI-e Exhibition in 2024:

1. Annual Industry Event

As the most influential semiconductor exhibition in South China, this year's exhibition is expected to attract more than 800 companies to participate, showcasing the semiconductor industry chain that integrates integrated circuits, electronic components, third-generation semiconductors, and industrial chain materials and equipment. The exhibition empowers enterprises to achieve trade cooperation and market development, strengthens the interaction between production, research and development, and sales, and provides comprehensive services and references for participating enterprises and visitors to gain a deeper understanding of the new trends in the future development of the semiconductor market.

2. Summit Forum Leading Industry Trends

Multiple forums were held simultaneously, covering topics such as integrated circuit chip design, semiconductor materials, 5G applications, intelligent consumer electronics, automotive electronics, wireless charging, etc. Experts and experts were gathered to discuss industry development trends, share information, and interact with hot topics.

3. Business pairing

The exhibition platform docking service has been upgraded. The organizer contacts VIP special invited buyers with clear procurement needs and supplier reserve needs before the exhibition to quickly identify exhibitors and improve your social accuracy by exploring clear procurement needs. Sincerely invite procurement leaders from both online and offline semiconductor industry users to meet and discuss one-on-one.

4. 100 media outlets promoting and reporting

SEMI-e focuses on shaping and promoting the brand of exhibitors. The full media matrix in consumer electronics, intelligent manufacturing, Internet of Things, automotive electronics, mobile phones, digital products, LED lighting, integrated circuits, 5G+, semiconductors, and other fields will be continuously promoted and reported in a comprehensive, multi angle, and three-dimensional manner before, during, and after the exhibition.

1. Design, Chip, Wafer Manufacturing and Packaging Exhibition Area Integrated Circuit Design and Chip, Wafer Manufacturing, SiP Advanced Packaging, Power Device Packaging and Testing, MEMS Packaging and Testing, Silicon Wafer and IC Packaging Carrier Board, Packaging Substrate and Application Manufacturing and Testing, EDA, MCU, Packaging Substrate Semiconductor Materials and Equipment and Components, etc

2. Advanced materials: silicon wafers and silicon-based materials, photomask templates, electronic gases, photoresists and their supporting reagents, CMP polishing materials, target materials, packaging substrates, lead frames, bonding wires, ceramic substrates, chip bonding materials, etc

3. IC carrier board/ceramic substrate: IC carrier board and packaging process (substrate, copper and other structural materials, dry film, gold salt and other chemicals/consumables) Chiplet packaging technology, storage, MEMS and chip applications, materials and equipment. Ceramic substrates, packaging materials and equipment, etc

4. Third generation semiconductors: nitride (GaN) and silicon carbide (SiC), zinc oxide (Zn0), diamond, wafer, substrate and epitaxy, power devices, IGBT packaging materials, RF devices and processing equipment, etc

5. AI and computing power, algorithms, storage, CPO co packaging exhibition area, artificial intelligence chips, solutions, computing power chips and solutions, algorithm solutions, data storage, optoelectronic co packaging modules and technologies and equipment, etc

6. Exhibition area for advanced packaging technology in automotive semiconductors/automotive grade, automotive grade semiconductor control/computing chips, power semiconductors (IGBT and MOSFET), automotive grade SiC modules, power management chips, automotive electronic micro assembly and power devices, packaging testing equipment, automation equipment, etc

7. Semiconductor specific equipment&components exhibition area thinning machine, single product furnace, grinder, heat treatment equipment, lithography machine, etching machine, ion implantation equipment, CVD/PVD equipment, cleaning equipment, cutting machine, loading machine, bonding machine, testing machine, sorting machine, probe table and components, etc. 9: Power supply&energy storage technology: energy storage power supply and sensors, battery management chips, power semiconductor devices and materials, and related equipment, instruments and components, etc

8. International Brand Area: International semiconductor material suppliers, well-known equipment suppliers, well-known packaging and testing, manufacturing, and OEM manufacturers, etc

Please contact the exhibition organizer for implementation before participating in the exhibition.

• Telephone:13601662201
• Truename:Wang Sheng
• Mobile:13601662201
• Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

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