2024 Shenzhen International Ceramic Packaging Shell Industry Exhibition

2024 Shenzhen International Power Semiconductor Industry Exhibition

Time: May 15-17, 2024 Address: Shenzhen International Convention and Exhibition Center (Bao'an New Hall)

Exhibition summary:

Packaging not only serves the functions of installing, fixing, sealing, protecting chips, and enhancing chip heat dissipation performance, but also serves as a bridge between the internal world of chips and external circuits. It can be said that electronic packaging not only needs to provide protection for the electrical, thermal, optical, and mechanical properties of chips, but also needs to meet the increasing performance requirements and functions such as reliability, heat dissipation, and power distribution at a certain cost. In the field of packaging, ceramic packaging has unique advantages compared to plastic and metal materials. Ceramic packaging belongs to airtight packaging, which has the advantages of good moisture resistance and less susceptibility to micro cracks; After thermal shock and temperature cycling experiments, there is no damage and high mechanical strength; Low coefficient of thermal expansion and high thermal conductivity; Good airtightness, the chip and circuit are not affected by the surrounding environment. Therefore, it is suitable for highly reliable microelectronic packaging, such as aerospace, weapons and equipment, ground radar, medical equipment, and sensors, which have high reliability requirements in industries. At present, although ceramic packaging accounts for a small proportion in the entire packaging industry, it is a packaging method with relatively complete performance. In recent years, fields such as smart cars, the Internet of Things, drones, and data centers have developed rapidly.

Ceramic packaging shells are widely used in fields such as communication, industrial lasers, consumer electronics, and automotive electronics, and can meet the development needs of emerging fields such as smart cars, the Internet of Things, drone markets, and virtual reality (VR). They have demand and foresight. The manufacturing process of ceramic packaging shells is complex and the technical threshold is high. Currently, the high-end electronic ceramic shell market is mainly occupied by foreign enterprises such as Japan, and China's high-end electronic ceramic shells mostly rely on imports. In recent years, domestic enterprises have been catching up and developing rapidly, but there is still a significant gap between them and foreign major manufacturers in terms of production scale and technological level. To strengthen the communication and linkage between the upstream and downstream of the ceramic packaging shell industry, the 2024 Shenzhen International Ceramic Packaging Shell Industry Exhibition will be held in Shenzhen on May 15th. The theme of this forum will revolve around simulation design, new materials for electronic ceramics, production processes, and application innovation. We sincerely invite friends from the upstream and downstream of the industry chain to exchange ideas and contribute to the development of the industry.

Exhibition scope:

Ceramic packaging, ceramic tube shell, and ceramic substrate production enterprises; Ceramic material enterprises such as alumina, aluminum nitride, silicon nitride, etc; Enterprises engaged in welding materials, metal slurries (tungsten slurries, molybdenum manganese slurries), kovar alloys, heat sinks, and other materials; Ceramic powder production and preparation equipment, powder grinding machine, sand mill, casting machine, punching machine, printing machine, laminating machine, laminating machine, hot cutting machine, discharge sintering, brazing equipment, electroplating, chemical plating, cleaning equipment, SMT machine, lead bonding machine, capping machine, parallel seam welding machine, cutting machine, marking machine, X-RAY, AOI, appearance inspection, film thickness tester, helium leak detector, performance inspection, aging testing equipment Upstream supply chain enterprises such as automation; Research institutes, university institutions, etc.

The main structure of ceramic packaging shell includes multi-layer ceramic matrix, metal ring frame, packaging cover plate, lead frame, heat dissipation bottom plate, etc. Multi layer ceramic shell manufacturing technology, including raw material preparation, casting, punching and punching, metalization printing, lamination, hot cutting, sintering, nickel plating, brazing, gold plating and other technologies; The packaging process includes shell cleaning, chip loading, cleaning, lead bonding, sealing, external lead processing, marking, testing, etc. The materials involved include ceramic powders such as alumina and aluminum nitride, as well as matching metalization slurries (tungsten slurry, molybdenum manganese slurry), kovar alloy, solder, heat sink, etc; The equipment includes powder grinding machines, casting machines, punching machines, printing machines, laminating machines, laminating machines, hot cutting machines, adhesive sintering, brazing equipment, electroplating, chemical plating, cleaning equipment, SMT machines, wire bonding machines, capping machines, parallel seam welding machines, cutting machines, marking machines, appearance inspection, film thickness testers, helium leak detectors, performance testing, aging equipment, etc. required for multi-layer ceramic manufacturing.

Participation Procedures

Fill out the booth application form, add a seal, and scan or fax it to the organizing committee of the conference. Within 3 working days of applying for a booth, the exhibition fees shall be wired or paid to the organizing committee. The principle of booth allocation is "apply first, pay first, and arrange first". Otherwise, the organizer will consider it as giving up the exhibition. After receiving the Exhibition Application Form and booth fees, the organizer will send the invoice along with the Exhibition Handbook to the exhibitors. Exhibitors voluntarily register to participate in the exhibition after learning about the exhibition situation, and cannot withdraw from the exhibition for any reason or reason, or the paid fees will not be refunded.

Organizing Committee of 2024 Shenzhen International Ceramic Packaging Shell Industry Exhibition

Contact person: Xu Jie 13636349782 WeChat: xj549296991

• Telephone:13636349782
• Truename:Xu Jie
• Mobile:13636349782
• Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

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