2024 China (Shenzhen) International Thermal Management Materials Technology Exhibition

2024 China (Shenzhen) International Thermal Management Materials Technology Exhibition

Time: April 9-11, 2024 Location: Shenzhen Convention and Exhibition Center (Futian)

Overall scale of the exhibition: covering an area of 100000 square meters, with over 1800 exhibitors, over 3600 booths, and over 100000 visitors

Theme: Building a one-stop selection and procurement platform for new technologies and materials

[Exhibition Background]

With the rapid advancement of electronic technology, chips, devices, and electronic devices are developing towards miniaturization, high-performance, integration, and multifunctionality, resulting in a sharp increase in power density and heat generation. The innovative applications of technologies in consumer electronics, 5G, XR, artificial intelligence, high-performance computing, data centers, the Internet of Things, power batteries, energy storage/heat, energy conservation and environmental protection, Industry 4.0, and other fields have put forward high standards and played a positive role in promoting efficient thermal management material technology and innovative solutions, ensuring the efficiency, reliability, safety, durability, and continuous stability of end products.

This exhibition will draw on the industry foresight of top research institutions and companies, covering multiple fields such as scientific frontiers, functional materials, technological applications, and engineering solutions in thermal management. We sincerely invite renowned scholars, technical experts, leading enterprise executives, government parks, scientific research institutes, and investment institutions from home and abroad to come to the stage of the conference to jointly explore new dynamics, technologies, developments, and trends in the thermal management industry, Presenting more than 30 multi-dimensional simultaneous events, including opening events, special reports, roundtable discussions, case studies, roadshows, interactive carnivals, and exhibition displays, to build a professional communication platform for technical exchange, disciplinary integration, and information exchange in the field of thermal management. The expected scale of the conference is over 2000 people. Special attention should be paid to intellectual property, entrepreneurial projects, solid-state refrigeration, and innovative technological achievements that can be transferred from laboratories to the market. We should actively promote mutual cooperation and empowerment in the field of thermal management through government, industry, academia, research and investment, and promote technological innovation and industrial development breakthroughs in the thermal management industry. This exhibition will efficiently present a one-stop value docking platform for the thermal management industry chain, which is an opportunity to meet and promote exchanges, cooperation, and win-win development among units in the thermal management industry. The aggregation and presentation of innovative material products, instruments, equipment, design and simulation, solutions, application scenarios, patented technologies, etc. will be an important component of the Expo; We will also hold themed forums, roundtable discussions, exhibition of innovative and entrepreneurial projects, new product releases, and demand docking in the field of thermal management. Innovative research findings and achievements of research institutes will also have the opportunity to transfer from laboratory docking to the market. Seizing cutting-edge trends and insights into development trends, we sincerely invite thermal management industry chain enterprises, professional purchasers, professional audiences and other professionals from all walks of life to participate in the exhibition and share development opportunities.

[CITME 2024 Exhibition Overview]

The 2024 Shenzhen International Thermal Management Materials Technology Exhibition is positioned as a one-stop, high-efficiency value service platform for the thermal management industry chain. In the context of "dual carbon", in order to promote the promotion and application of new products, technologies, materials, processes, and equipment in the thermal management industry, as well as economic and trade exchanges, relying on various industrial clusters such as electronic information, new materials, new energy, semiconductors, digital economy, automobiles, smart networking, green and low-carbon, and guided by the value advantages and application scenarios of thermal management, we can gain insights and grasp the policies, science, materials, and technology of the thermal management industry Frontier dynamics and development trends in standards and engineering.

Organizational structure

Organizer: China Electronics Equipment Corporation (CEC) Exhibition and Information Communication Co., Ltd. Saite Exhibition (Shenzhen) Co., Ltd

Organizer: China Electronics Exhibition and Information Communication Co., Ltd. Saiaite Exhibition (Shenzhen) Co., Ltd

Executing unit: Zhongjia Exhibition (Shanghai) Co., Ltd

Simultaneously held: China Electronic Information Expo (CITE Exhibition)

Exhibition Schedule

Exhibition setup: April 7-8, 2024

Exhibition: April 9-11, 2024

Dismantling: Afternoon of April 11, 2024

Exhibition Procedures

1. After confirming the participation, request the exhibition application form from the organizing unit and fill it out by mail or fax to the organizing unit

2. Within 3 working days of applying for a booth, 50% (deposit) or full payment of the exhibition fee shall be wired or paid to the organizing unit. After the organizing unit finds the payment, it will send the invoice to the exhibiting unit by express delivery within 3 working days. If there is any balance, please pay it in full before March 10, 2023.

3. The principle of booth allocation is "apply first, pay first, arrange first". One month before the start of the exhibition, provide the "Exhibition Handbook" to exhibitors

4. If the exhibiting company withdraws midway, the exhibition fee paid will not be refunded. The organizing unit of this exhibition reserves the final interpretation right for this event.

Index keywords: Thermal Management Exhibition, Thermal Management Technology Exhibition, Thermal Management Materials Exhibition, Thermal Conductivity Exhibition, Thermal Conductivity Material Exhibition, Heat Dissipation Exhibition, Heat Dissipation Technology Exhibition, Thermal Conductivity Technology Exhibition, Automotive Thermal Management Exhibition, Liquid Cooling Exhibition, Liquid Cooling Material Exhibition, Liquid Cooling Technology Exhibition, Air Cooling Technology Exhibition, Cooling Liquid Exhibition, New Energy Passenger Vehicle Thermal Management System Exhibition, Energy Storage Thermal Management System Exhibition, Power Battery Thermal Management Exhibition, Fuel Cell Thermal Management Exhibition, Shenzhen Thermal Management Exhibition, China Thermal Management Exhibition, Air Conditioning Thermal Management System Exhibition, Mobile Thermal Management Exhibition, Electronic Materials Thermal Management Exhibition, Home Electric Heating Management Exhibition

◆ Raw material display:

① Thermal conductive fillers: inorganic non-metals: aluminum oxide, silicon oxide, zinc oxide, boron nitride, aluminum nitride, silicon nitride, silicon carbide, magnesium oxide, beryllium oxide, graphite, carbon black, etc; Metal powders: copper powder, silver powder, gold powder, nickel powder, and aluminum powder, etc

② Packaging materials: metal: aluminum, copper (beryllium copper), tungsten/copper, molybdenum/copper, silicon/aluminum, beryllium/aluminum, foam metal/porous metal, etc; Rubber; Ceramics: alumina, zirconia, carbides, borides, nitrides, silicides; Glass, etc

③ Polymer materials: organic silicon, epoxy resin, polyurethane, acrylic resin, polyimide, phenolic resin, etc

◆ Display of guide/heat dissipation materials:

① Thermal interface materials: thermal conductive silica gel, thermal conductive silicone grease, thermal conductive gel, thermal conductive pad/carbon fiber thermal conductive pad, polymer based composite thermal conductive material, liquid metal, thermal conductive potting glue, etc

② Thermal conductive polymers: thermal conductive plastics (PPS, PA6/PA66, PC, PP, PPA, LDPE, PEEK), thermal insulation plastics, thermal rubber, etc

③ Carbon materials: graphite film (PI film), diamond, carbon nanotubes, carbon fiber short fibers, graphene thermal conductive film, etc

④ Ceramic substrates: alumina (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), beryllium oxide (BeO); Silicon carbide (SiC), boron nitride (BN), etc

⑤ Heat sink material: metal/alloy (semi-solid die-casting parts); Diamond/copper, diamond/aluminum and other composite materials, graphite/copper, graphite/aluminum and other composite materials, metal matrix composite materials

⑥ Phase change materials (heat storage): paraffin, fatty alcohols, fatty acids, alkane based alloys; Molten salts, salt water complexes, eutectic mixtures, etc

⑦ Thermal insulation materials: aerogel materials (carbon base, silica, zirconia, alumina, etc.), carbon felt, composite silicate materials, etc

⑧ Solid state refrigeration: thermoelectric refrigeration, radiation refrigeration, etc

⑨ Auxiliary materials: release film, double-sided adhesive, etc

◆ Display of guide/heat dissipation components:

① Heat pipes/soaking plates, copper clad plates, power devices (silicon carbide, gallium nitride, gallium oxide, MOSFET, IGBT) and modules, etc. ② Fans, heat sinks, water-cooled plates, heat exchangers, air preheaters, thermal conductivity/cooling modules, etc

◆ Instrument/Equipment Display: Analysis and Testing Instruments: Thermogravimetric Method, Differential Thermal Analysis, Differential Scanning Calorimetry, Escape Gas Detection and Analysis, Thermal Expansion Method, Dynamic Thermomechanical Analysis, Thermophysical Property Measurement Equipment, etc;

Automation equipment: dispensing machine, coating/laminating/rolling/winding, carbonization/graphitization, die-cutting, homogenization, dispersion, grinding, defoaming, etc

Laser and Optoelectronics: optical devices and components, optical devices and instruments, optical and optoelectronic technology products and their components, optical communication technology and products, optoelectronic sensors and their applications, and related advanced production and manufacturing equipment

◆ Thermal Design Display: Thermal Design: Thermal Simulation Simulation/Thermal Design Software Solution Display

① Thermal management solutions: air cooling technology, liquid cooling technology, 3D printing

② Thermal analysis: standard, testing, certification, external testing service platform (university/research institute)

• Telephone:133 2199 2883
• Truename:Mr. Zhu
• Mobile:133 2199 2883
• Address:Intersection of Fuhua 3rd Road and Jintian Road in Futian District, Shenzhen City, Guangdong Province

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