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2024 China (Beijing) International Intelligent Sensing Exhibition
Industry:

Communications / Electronics

Time:

2024/07/24 - 07/26 (Wed To Fri Total 3 Days)    Error Correction

Address:

Beijing Beijing National Convention Center ChinaBeijingChaoyang District Olympic Park, Beichen Road, Chaoyang District, Beijing

Sponsor:

2024 China (Beijing) International Intelligent Sensing Exhibition

Organizer:

2024 China (Beijing) International Intelligent Sensing Exhibition

Closed

INTRODUCTION

2024 China (Beijing) International Intelligent Sensing Exhibition - www.globalomp.com

2024 China (Beijing) International Intelligent Sensing Exhibition - www.globalomp.com

2024 China (Beijing) International Intelligent Sensing Exhibition

Time: July 24-26, 2024

Address: National Convention Center, Beijing

International Intelligent Sensing Exhibition China Beijing looks forward to your enthusiastic participation!

·Preface:

Welcome all relevant units to participate and visit! The 2024 China (Beijing) International Intelligent Sensing Exhibition will be held grandly from July 24th to 26th, 2024 at the Beijing National Convention Center. The exhibition aims to "highlight brand, explore and innovate, focus on practical results, and strengthen services". With unique creativity, scientific and reasonable integrated communication, and excellent services, the exhibition will provide a "high-level, high-grade, and high-quality" exhibition and exchange stage for exhibitors with a new concept, The exhibition area is 20000 square meters, and nearly 30 international associations will organize and invite exhibitors, purchasers, and agents to actively participate in trade negotiations at the exhibition hall. A large number of high-quality domestic and foreign visitors are the best platform for conducting business activities! The most reliable top tier trade negotiation exhibition in the global intelligent sensing industry!!

·Reason for Exhibition

We will invite high-quality professional visitors to the exhibition through the following methods:

We will release over 500 text previews and soft press releases of this exhibition through over 100 large online media outlets. This exhibition plans to send 50000 invitation letters, admission tickets, visit guides, and other exhibition related invitation information through distribution, mailing, and other means at other related exhibitions. 20000 faxes and 200000 text messages will be sent in groups. For professional buyers, an appointment registration system will be implemented to ensure the quality of the audience.

For high-level leaders from government departments, industry associations, and professional institutions, the exhibition office extensively invites industry executives to attend the conference through telephone contact, on-site visits, summit promotion, and other means.

·Audience range

The exhibition will invite experts from relevant scientific research institutions across the country, including consumer electronics, intelligent driving, communication electronics, intelligent manufacturing, mobile phones, cameras, computers, tablets, digital devices, medical equipment, precision instruments, industrial automation, semiconductors, data storage, and other manufacturing industries, universities, research institutes, consulting institutions, and public institutions to visit and negotiate.

·Schedule

Registration and Exhibition: July 22-23, 2024 Opening Ceremony: July 24, 2024 (9:00-9:30)

Exhibition: July 24-26, 2024. Withdrawal: Afternoon of July 26, 2024

·Exhibition scope

3D imaging and sensing components and materials: VCSEL chip, EEL, DOE, infrared LED, MEMS micro mirror, CMOS image sensor, CCD image sensor, visual sensor, system image processing chip, DDI display chip, etc;

3D cameras: structured light cameras, TOF cameras, binocular stereo imaging visual cameras, infrared sensors, infrared optical emitters, infrared CMOS image sensors, image processing chips, sensor modules, light source detection, image algorithms, etc;

Biometric identification: biosensors, fingerprint sensors, optical sensors, RF sensors, temperature sensors, iris recognition, environmental sensors, biometric filters, gesture recognition, speech recognition, pressure sensors, CMOS sensors, ultrasonic sensors, DOE, MCU, FPCB, biometric sensor SoC chips, biosensor chips and materials, system service providers, etc;

MEMS and sensors: inertial sensors, pressure sensors, mechanical sensors, MEMS biosensors, MEMS image sensors, MEMS tactile sensors, temperature sensors, angular velocity sensors, pulse sensors, smoke sensors, fingerprint sensors, MEMS microphones, gyroscopes, accelerometers, magnetic sensors, acoustic sensors, ASIC chips, microfluidic medical chips, pressure chip series, infrared thermopile chips Sensor modules, sensor chips, MEMS/Sensor solutions, RF solutions, etc;

Industrial sensor fiber optic sensors: automotive sensors, spectral confocal displacement sensors, photoelectric sensors, fiber optic sensors, grating sensors, gas sensors, temperature and humidity sensors, environmental sensors, position sensors, acceleration sensors, flow sensors, visual sensors, dynamic torque sensors, ultrasonic sensors, liquid level sensors, displacement sensors, environmental sensors, resistance sensors, etc Various sensitive components and sensor products such as resistance strain sensors, piezoresistive sensors, etc;

Lidar products: mechanical rotary, semi-solid (rotating mirror, MEMS micro mirror), solid state (Flash, OPA, FWCW), etc;

Core components of LiDAR include lasers, detectors, scanners and components, MEMS micro mirrors, photodetectors and receiver ICs, APD avalanche diodes, SAPD single electron avalanche diodes, EEL, PIN, SiPM, narrowband filters, position and navigation systems, etc;

Testing, measurement, and production equipment: 3D VCSEL testing plan, LiDAR product testing equipment, visual inspection and systems, visual sensing systems, and sensory measurement equipment, etc;

·Simultaneously held

2024 China (Beijing) International Intelligent Sensing Industry Development Summit Forum

Cost: 30 minutes per session, with a cost of 20000 RMB for domestic companies and 3000 USD for foreign companies.

Conference fee: 2000 yuan/person (including meal, material, inspection fees, etc.)

·Exhibition fees

Exhibition project specifications and requirements: domestic enterprises, joint ventures, foreign-funded enterprises

Standard booth 3m x 3m, 16000 yuan/piece, 18000 yuan/piece, 5000 US dollars/piece

Double booth 3m x 3m 17000 yuan/piece 20000 yuan/piece 6000 US dollars/piece

Indoor open space 36m ² Minimum order of 1700 yuan/m ² 1800 yuan/m ² $500/m ²

The standard booth configuration includes: three wall panels, two spotlights, one consultation table, two chairs, carpets, one 220V AC power socket, and Chinese and English lintels for each standard booth. The indoor bare space booth has no configuration: (requires a minimum rent of 36 square meters).

·[Advertising in the Journal]

Introduction to the Colored Inner Page Text on the Front Cover, Second Cover, Third Cover, and Back Cover

25000 yuan, 20000 yuan, 10000 yuan, 15000 yuan, 10000 yuan, 6000 yuan, 3000 yuan

Note: The layout specifications of the conference magazine (210mm x 285mm), imported copperplate paper, four color precision printing, and the layout content are designed by the exhibitors themselves

·Contact information

Secretariat of the Organizing Committee of the 2024 China (Beijing) International Intelligent Sensing Exhibition (Exhibition Office)

Phone: 021-54321886

Fax: 021-51862460

Contact person: Mr. Chen 18516621881 WeChat synchronization

Conference website:

Kind reminder: Enterprises must register as early as possible in order to obtain a relatively advantageous position


Scope

2024 China (Beijing) International Intelligent Sensing Exhibition - www.globalomp.com


Costs & Precautions

Please contact the exhibition organizer for implementation before participating in the exhibition.

Contact

  • Telephone:18516621881
  • Truename:Mr. Chen
  • Mobile:18516621881
  • Address:Olympic Park, Beichen Road, Chaoyang District, Beijing

Disclaimer

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870

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